Abstract
A new micro inductor with a thickness of 300 μm was developed by using power MEMS and continuous deposition technology. The high-quality, superior dc-biased properties of the low height micro inductors for flip chip micro power sources was also described. The efficiency and dc-biased properties of the inductors and the dispersion of the magnetic flux was investigated and calculated.
Original language | English |
---|---|
Pages (from-to) | EA05 |
Journal | Digests of the Intermag Conference |
Publication status | Published - 2003 |
Event | Intermag 2003: International Magnetics Conference - Boston, MA, United States Duration: 2003 Mar 28 → 2003 Apr 3 |