Micro inductor for flip chip micro power source

E. Sugawara, N. Wakou, F. Sato, H. Matsuki, M. Yamaguchi, K. Shirakawa, T. Masumoto

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)


A new micro inductor with a thickness of 300 μm was developed by using power MEMS and continuous deposition technology. The high-quality, superior dc-biased properties of the low height micro inductors for flip chip micro power sources was also described. The efficiency and dc-biased properties of the inductors and the dispersion of the magnetic flux was investigated and calculated.

Original languageEnglish
Pages (from-to)EA05
JournalDigests of the Intermag Conference
Publication statusPublished - 2003
EventIntermag 2003: International Magnetics Conference - Boston, MA, United States
Duration: 2003 Mar 282003 Apr 3


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