Micro texture control for highly reliable copper fine bumps for 3D integration

Masara Gotoh; Ken Suzuki; Hideo Miura

doi:10.1109/IMPACT.2014.7048346

Micro texture control for highly reliable copper fine bumps for 3D integration

Masara Gotoh, Ken Suzuki, Hideo Miura

Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to assure the long-term reliability. It was found that the formation of high quality columnar grains with (001) orientation can improve the reliability drastically.

Original language	English
Title of host publication	2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publication	Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	53-56
Number of pages	4
ISBN (Electronic)	9781479977277
DOIs	https://doi.org/10.1109/IMPACT.2014.7048346
Publication status	Published - 2014
Event	9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China Duration: 2014 Oct 22 → 2014 Oct 24

Publication series

Name	2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Conference

Conference	9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
Country/Territory	Taiwan, Province of China
City	Taipei
Period	14/10/22 → 14/10/24

Access to Document

10.1109/IMPACT.2014.7048346

Cite this

Gotoh, M., Suzuki, K., & Miura, H. (2014). Micro texture control for highly reliable copper fine bumps for 3D integration. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings (pp. 53-56). Article 7048346 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2014.7048346

Gotoh, Masara ; Suzuki, Ken ; Miura, Hideo. / Micro texture control for highly reliable copper fine bumps for 3D integration. 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 53-56 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

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title = "Micro texture control for highly reliable copper fine bumps for 3D integration",

abstract = "The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to assure the long-term reliability. It was found that the formation of high quality columnar grains with (001) orientation can improve the reliability drastically.",

author = "Masara Gotoh and Ken Suzuki and Hideo Miura",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 ; Conference date: 22-10-2014 Through 24-10-2014",

year = "2014",

doi = "10.1109/IMPACT.2014.7048346",

language = "English",

series = "2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings",

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Gotoh, M, Suzuki, K & Miura, H 2014, Micro texture control for highly reliable copper fine bumps for 3D integration. in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings., 7048346, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 53-56, 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014, Taipei, Taiwan, Province of China, 14/10/22. https://doi.org/10.1109/IMPACT.2014.7048346

Micro texture control for highly reliable copper fine bumps for 3D integration. / Gotoh, Masara; Suzuki, Ken ; Miura, Hideo.
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. p. 53-56 7048346 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to assure the long-term reliability. It was found that the formation of high quality columnar grains with (001) orientation can improve the reliability drastically.

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Gotoh M, Suzuki K , Miura H. Micro texture control for highly reliable copper fine bumps for 3D integration. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. p. 53-56. 7048346. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). doi: 10.1109/IMPACT.2014.7048346

Micro texture control for highly reliable copper fine bumps for 3D integration

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