FingerprintDive into the research topics of 'Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integration'. Together they form a unique fingerprint.
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Ken Suzuki, Hideo Miura, Osamu Asai, Ryosuke Furuya, Jaeuk Sung, Naokazu Murata
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution