Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integration

Engineering

• Interconnection 100%
• Thin Films 66%
• Induced Stress 50%
• Electroplated Copper Thin Film 50%
• Residual Stress 50%
• Annealing 33%
• Tensile Residual Stress 33%
• Room Temperature 16%
• Crystallinity 16%
• Shrinkage 16%
• Grain Boundary 16%
• Annealing Temperature 16%
• Densification 16%
• Main Reason 16%
• Grain Boundary Diffusion 16%
• Integration 16%
• Recrystallization 16%

Physics

• Thin Films 66%
• Migration 50%
• Annealing 33%
• Voids 33%
• Room Temperature 16%
• Crystallinity 16%
• Shrinkage 16%
• Diffusivity 16%
• Electroplating 16%
• Atoms 16%
• Molecular Dynamics 16%
• Copper 16%
• Grain Boundaries 16%
• Recrystallization 16%

Material Science

• Thin Films 66%
• Texture 50%
• Shrinkage 16%
• Grain Boundary 16%