Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

Naokazu Murata; Naoki Saito; Fumiaki Endo; Kinji Tamakawa; Ken Suzuki; Hideo Miura

doi:10.1109/ECTC.2011.5898811

Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, Hideo Miura

ENG - Fracture and Reliability Research Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

Both mechanical and electronic properties of electroplated copper films used for interconnections were investigated experimentally considering the change of their micro texture caused by heat treatment. Since those properties varied drastically depending on the electroplating conditions and thermal history after the electroplating, a novel evaluation method of the crystallinity of grains and grain boundaries of the electroplated copper thin films has been proposed by applying the conventional electron back scatter diffraction method. It was found the porous grain boundaries in the films cause brittle mechanical and electrical fractures of the films. The proposed method was effective for evaluating the crystallinity of grain boundaries quantitatively, and thus, estimating both the mechanical and electrical properties of the films used for mass production.

Original language	English
Title of host publication	2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages	2119-2125
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2011.5898811
Publication status	Published - 2011 Jul 21
Event	2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States Duration: 2011 May 31 → 2011 Jun 3

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	2011 61st Electronic Components and Technology Conference, ECTC 2011
Country/Territory	United States
City	Lake Buena Vista, FL
Period	11/5/31 → 11/6/3

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ECTC.2011.5898811

Cite this

Murata, N., Saito, N., Endo, F., Tamakawa, K., Suzuki, K., & Miura, H. (2011). Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 2119-2125). [5898811] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898811

Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections. / Murata, Naokazu; Saito, Naoki; Endo, Fumiaki et al.
2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. p. 2119-2125 5898811 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Murata, N, Saito, N, Endo, F, Tamakawa, K, Suzuki, K & Miura, H 2011, Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections. in 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011., 5898811, Proceedings - Electronic Components and Technology Conference, pp. 2119-2125, 2011 61st Electronic Components and Technology Conference, ECTC 2011, Lake Buena Vista, FL, United States, 11/5/31. https://doi.org/10.1109/ECTC.2011.5898811

Murata N, Saito N, Endo F, Tamakawa K, Suzuki K , Miura H. Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. p. 2119-2125. 5898811. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2011.5898811

@inproceedings{509c1ddad1a5447c8569b239f253b5b4,

title = "Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections",

abstract = "Both mechanical and electronic properties of electroplated copper films used for interconnections were investigated experimentally considering the change of their micro texture caused by heat treatment. Since those properties varied drastically depending on the electroplating conditions and thermal history after the electroplating, a novel evaluation method of the crystallinity of grains and grain boundaries of the electroplated copper thin films has been proposed by applying the conventional electron back scatter diffraction method. It was found the porous grain boundaries in the films cause brittle mechanical and electrical fractures of the films. The proposed method was effective for evaluating the crystallinity of grain boundaries quantitatively, and thus, estimating both the mechanical and electrical properties of the films used for mass production.",

author = "Naokazu Murata and Naoki Saito and Fumiaki Endo and Kinji Tamakawa and Ken Suzuki and Hideo Miura",

year = "2011",

month = jul,

day = "21",

doi = "10.1109/ECTC.2011.5898811",

language = "English",

isbn = "9781612844978",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "2119--2125",

booktitle = "2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011",

note = "2011 61st Electronic Components and Technology Conference, ECTC 2011 ; Conference date: 31-05-2011 Through 03-06-2011",

}

TY - GEN

T1 - Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

AU - Murata, Naokazu

AU - Saito, Naoki

AU - Endo, Fumiaki

AU - Tamakawa, Kinji

AU - Suzuki, Ken

AU - Miura, Hideo

PY - 2011/7/21

Y1 - 2011/7/21

N2 - Both mechanical and electronic properties of electroplated copper films used for interconnections were investigated experimentally considering the change of their micro texture caused by heat treatment. Since those properties varied drastically depending on the electroplating conditions and thermal history after the electroplating, a novel evaluation method of the crystallinity of grains and grain boundaries of the electroplated copper thin films has been proposed by applying the conventional electron back scatter diffraction method. It was found the porous grain boundaries in the films cause brittle mechanical and electrical fractures of the films. The proposed method was effective for evaluating the crystallinity of grain boundaries quantitatively, and thus, estimating both the mechanical and electrical properties of the films used for mass production.

AB - Both mechanical and electronic properties of electroplated copper films used for interconnections were investigated experimentally considering the change of their micro texture caused by heat treatment. Since those properties varied drastically depending on the electroplating conditions and thermal history after the electroplating, a novel evaluation method of the crystallinity of grains and grain boundaries of the electroplated copper thin films has been proposed by applying the conventional electron back scatter diffraction method. It was found the porous grain boundaries in the films cause brittle mechanical and electrical fractures of the films. The proposed method was effective for evaluating the crystallinity of grain boundaries quantitatively, and thus, estimating both the mechanical and electrical properties of the films used for mass production.

UR - http://www.scopus.com/inward/record.url?scp=79960414239&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79960414239&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2011.5898811

DO - 10.1109/ECTC.2011.5898811

M3 - Conference contribution

AN - SCOPUS:79960414239

SN - 9781612844978

T3 - Proceedings - Electronic Components and Technology Conference

SP - 2119

EP - 2125

BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011

T2 - 2011 61st Electronic Components and Technology Conference, ECTC 2011

Y2 - 31 May 2011 through 3 June 2011

ER -

Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this