TY - GEN
T1 - Micro thermal sensor for nanometric surface defect inspection
AU - Shimizu, Yuki
AU - Matsuno, Yuki
AU - Ohba, Yuta
AU - Gao, Wei
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/11/21
Y1 - 2016/11/21
N2 - This paper presents a concept of a micro thermal sensor to be used for defect inspection of a smoothly-finished surface such as a bare wafer or a hard disk. In the proposed concept, existences of the defects on a measurement surface will be detected by scanning the surface with the micro thermal sensor, which is utilized to detect the variation of the thermal flow in-between the sensor surface and the measurement surface. The proposed micro thermal sensor has a possibility of detecting various types of surface defects. An existence of the defect having a convex shape such as an asperity or a particle can be found by detecting a heat generated at the collision between the sensor surface and the tip of the defect. In addition, the thermal sensor is expected to be applied for the inspection of pits or scratches in a concave shape on the smooth surface. When the thermal sensor is placed with respect to the measurement surface with a tiny gap of less than 1 μm, a heat transfer system sensitive against the gap variation will be constructed at the interface between the thermal sensor and the measurement surface becomes a system.
AB - This paper presents a concept of a micro thermal sensor to be used for defect inspection of a smoothly-finished surface such as a bare wafer or a hard disk. In the proposed concept, existences of the defects on a measurement surface will be detected by scanning the surface with the micro thermal sensor, which is utilized to detect the variation of the thermal flow in-between the sensor surface and the measurement surface. The proposed micro thermal sensor has a possibility of detecting various types of surface defects. An existence of the defect having a convex shape such as an asperity or a particle can be found by detecting a heat generated at the collision between the sensor surface and the tip of the defect. In addition, the thermal sensor is expected to be applied for the inspection of pits or scratches in a concave shape on the smooth surface. When the thermal sensor is placed with respect to the measurement surface with a tiny gap of less than 1 μm, a heat transfer system sensitive against the gap variation will be constructed at the interface between the thermal sensor and the measurement surface becomes a system.
UR - http://www.scopus.com/inward/record.url?scp=85006868818&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85006868818&partnerID=8YFLogxK
U2 - 10.1109/NANO.2016.7751308
DO - 10.1109/NANO.2016.7751308
M3 - Conference contribution
AN - SCOPUS:85006868818
T3 - 16th International Conference on Nanotechnology - IEEE NANO 2016
SP - 978
EP - 979
BT - 16th International Conference on Nanotechnology - IEEE NANO 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE International Conference on Nanotechnology - IEEE NANO 2016
Y2 - 22 August 2016 through 25 August 2016
ER -