TY - GEN
T1 - Micro Vapor Cells Sealed by Two-Step Bonding for Miniature Atomic Clocks
AU - Nishino, Hitoshi
AU - Furuya, Yasubumi
AU - Ono, Takahito
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This study introduces a new method to fabricate and evaluation of vapor cells with Rb sealed by anodic bonding at wafer level for miniature atomic clocks. The proposed method achieves miniaturization and long-term frequency stability by the wafer-level process. Rb encapsulation is achieved by two-step bonding. The vapor cells are fabricated to seal with buffer gas to confirm the stability, and the achieved Allan deviation at an averaging time of 3000 s is 1.7 × 10-11. These results show that the proposed method has improved the long-term stability and has achieved miniaturization compared to the vapor cell fabricated by the conventional method, which uses an alkali-atom dispenser.
AB - This study introduces a new method to fabricate and evaluation of vapor cells with Rb sealed by anodic bonding at wafer level for miniature atomic clocks. The proposed method achieves miniaturization and long-term frequency stability by the wafer-level process. Rb encapsulation is achieved by two-step bonding. The vapor cells are fabricated to seal with buffer gas to confirm the stability, and the achieved Allan deviation at an averaging time of 3000 s is 1.7 × 10-11. These results show that the proposed method has improved the long-term stability and has achieved miniaturization compared to the vapor cell fabricated by the conventional method, which uses an alkali-atom dispenser.
KW - Anodic bonding
KW - MEMS
KW - Miniature atomic clocks
KW - Two-step bonding
KW - Vapor cell
UR - http://www.scopus.com/inward/record.url?scp=85126396006&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85126396006&partnerID=8YFLogxK
U2 - 10.1109/MEMS51670.2022.9699590
DO - 10.1109/MEMS51670.2022.9699590
M3 - Conference contribution
AN - SCOPUS:85126396006
T3 - IEEE Symposium on Mass Storage Systems and Technologies
SP - 983
EP - 986
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - IEEE Computer Society
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -