@inproceedings{5f433f835a4943d39bead4d79d331830,
title = "Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI",
abstract = "3D-LSI stack containing diametrically highly-scaled through-silicon-vias (TSVs) with diameter 2μm as well as conventional 20 μm-width Cu-TSVs were carefully studied for the thermo-mechanical stress induced by Cu-TSVs via micro-X-ray diffraction using synchrotron radiation at Spring-8. It was observed that the TSV diameter has huge impact on the magnitude of resultant thermo-mechanical stress. The 20 μm-width Cu-TSV has induced more than-1500 MPa of stress in the vicinal Si, while the 2 μmwidth Cu-TSV induced less than-10 MPa of compressive stress in the surrounding Si. Therefore by decreasing the TSV diameter, one can virtually eliminate the thermo-mechanical stress induced by TSV.",
keywords = "Fine-pitch, Micro - X-ray diffraction, Thermo-mechanical stress, Through-Si-via",
author = "M. Murugesan and T. Fukushima and Bea, {J. C.} and Lee, {K. W.} and M. Koyanagi and Y. Imai and S. Kimura and T. Tanaka",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; International 3D Systems Integration Conference, 3DIC 2014 ; Conference date: 01-12-2014 Through 03-12-2014",
year = "2014",
doi = "10.1109/3DIC.2014.7152158",
language = "English",
series = "2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings",
address = "United States",
}