Abstract
Magnetic thin film inductors were developed for mobile communication handsets application. A magnetic thin film-covered spiral coil was microfabricated on high resistivity silicon wafer substrate. Large spacing between the spiral coil and silicon wafer was obtained to reduce eddy current losses in the substrate. The material development, complete microfabrication and finite element simulation of the inductors are further explored.
Original language | English |
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Pages (from-to) | 7919-7922 |
Number of pages | 4 |
Journal | Journal of Applied Physics |
Volume | 85 |
Issue number | 11 |
DOIs | |
Publication status | Published - 1999 Jun |