Micromachined structure for Si transmission optical components

Recent progress of the deep reactive ion etching explores several new applications of three dimensional structures of silicon devices. We have developed new optical and electrical devices having the penetrating holes to transmit the optical beam to the down stream. The transmission silicon position sensor having the divided cell type photodiode on the Si mesh structure is fabricated. The beam splitter is considered to be integrated in this device and a part of the incident light beam is detected by the photodiode. Using nearly same technique, the pinhole of the spatial filter surrounded by the divided cell type photodiode is fabricated to detect the relative position between the incident beam spot and the center pinhole.