Microscale adhesion strength evaluation of cold sprayed copper deposit

Y. Ichikawa, R. Tokoro, K. Ogawa

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Adhesion strength is one of the most important characteristics when discussing the reliability of a cold spray. A focused ion beam (FIB) was used to conduct ultra-micro tensile tests for micro-scale adhesive strength evaluations of high-pressure type cold-sprayed copper deposition on an aluminum substrate. It was also used to determine the essential factor of adhesion strength and the coating formation mechanism. The micro-scale local adhesion strength of cold-sprayed copper deposits on an aluminum substrate was successfully evaluated by FIB microtensile tests. The average local adhesion strength of this deposit was 223 MPa. The variations in adhesion strength between deposit and substrate were smaller than the interfacial strength of cold-sprayed deposits. This was caused by the repeated collision of these subsequent particles.

Original languageEnglish
Title of host publicationInternational Thermal Spray Conference and Exposition, ITSC 2017
PublisherASM International
Pages328-332
Number of pages5
ISBN (Electronic)9781510858220
Publication statusPublished - 2017
EventInternational Thermal Spray Conference and Exposition, ITSC 2017 - Dusseldorf, Germany
Duration: 2017 Jun 72017 Jun 9

Publication series

NameProceedings of the International Thermal Spray Conference
Volume1

Conference

ConferenceInternational Thermal Spray Conference and Exposition, ITSC 2017
Country/TerritoryGermany
CityDusseldorf
Period17/6/717/6/9

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