Microstructural evolution of pure copper during friction-stir welding

S. Mironov, K. Inagaki, Y. S. Sato, H. Kokawa

Research output: Contribution to journalArticlepeer-review

55 Citations (Scopus)


The microstructural evolution of pure copper during friction-stir welding was found to be principally influenced by welding temperature. At temperatures below ~0.5 Tm (where Tm is melting point), the microstructure was shown to be essentially determined by continuous recrystallization, leading to significant grain refinement and related material strengthening in the stir zone. In contrast, grain structure development at temperatures above ~0.5 Tmm was dominated by discontinuous recrystallization producing a relatively coarse grain structure in the stir zone and giving rise to material softening.

Original languageEnglish
Pages (from-to)367-381
Number of pages15
JournalPhilosophical Magazine
Issue number4
Publication statusPublished - 2015 Feb 1


  • copper
  • electron backscatter diffraction (EBSD)
  • friction-stir welding
  • microstructure
  • texture

ASJC Scopus subject areas

  • Condensed Matter Physics


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