TY - GEN
T1 - Miniature surface acoustic wave devices with excellent temperature stability using high density metal electrodes and SiO2 film
AU - Kadota, Michio
AU - Nakao, Takeshi
AU - Nishiyama, Kenji
AU - Kido, Shunsuke
AU - Kato, Masanori
AU - Omote, Ryoichi
AU - Yonekura, Hiroshi
AU - Takada, Norihiko
AU - Kita, Ryoichi
AU - Nakai, Yasuharu
AU - Yamamoto, Daisuke
PY - 2008/12/12
Y1 - 2008/12/12
N2 - Currently, miniature surface acoustic wave (SAW) devices (filters and duplexers) with a good temperature stability are strongly required. In order to realize its requirement, various SAW substrates combining a high density metal electrode, a SiO2 film, and LiTaO3 or LiNbO3 substrate were researched. Their combinations offer excellent properties such as large electrode reflection coefficient, large mechanical coupling factor, low velocity, and good temperature stability. This paper reviews realization of miniature SAW devices with low insertion loss and good temperature stability, such as SAW duplexers for personal communication service system in the United States (US-PCS) and wide band code division multiple access system (W-CDMA) using thier combinatios.
AB - Currently, miniature surface acoustic wave (SAW) devices (filters and duplexers) with a good temperature stability are strongly required. In order to realize its requirement, various SAW substrates combining a high density metal electrode, a SiO2 film, and LiTaO3 or LiNbO3 substrate were researched. Their combinations offer excellent properties such as large electrode reflection coefficient, large mechanical coupling factor, low velocity, and good temperature stability. This paper reviews realization of miniature SAW devices with low insertion loss and good temperature stability, such as SAW duplexers for personal communication service system in the United States (US-PCS) and wide band code division multiple access system (W-CDMA) using thier combinatios.
UR - http://www.scopus.com/inward/record.url?scp=57349137234&partnerID=8YFLogxK
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U2 - 10.1109/MWSYM.2008.4632965
DO - 10.1109/MWSYM.2008.4632965
M3 - Conference contribution
AN - SCOPUS:57349137234
SN - 9781424417810
T3 - IEEE MTT-S International Microwave Symposium Digest
SP - 847
EP - 850
BT - 2008 IEEE MTT-S International Microwave Symposium Digest, MTT
T2 - 2008 IEEE MTT-S International Microwave Symposium Digest, MTT
Y2 - 15 June 2008 through 20 June 2008
ER -