TY - JOUR
T1 - Molecular dynamics simulations on the oxidation of Si(100)/SiO2 interface
T2 - Emissions and incorporations of Si-related species into the SiO2 and substrate
AU - Takahashi, Norihiko
AU - Yamasaki, Takahiro
AU - Kaneta, Chioko
N1 - Publisher Copyright:
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim 251 11 November 2014 10.1002/pssb.201400068 Invited Article Invited Article Materials research for Group IV semiconductors © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
PY - 2014/11/1
Y1 - 2014/11/1
N2 - Si(100)-oxidation processes at the Si/SiO2 interface and in the SiO2 region are investigated focusing on the dynamics of Si and SiO emissions from the interface and the following incorporation into the substrate and/or SiO2. To clarify these atomic processes, classical molecular dynamics (MD) simulations with variable charge interatomic potentials are performed. By incorporating oxygen atoms, twofold coordinated (twofolded) Si atoms are formed after structural relaxation at the interface. The energy changes of the twofolded Si emissions into the substrate and SiO2 are estimated to be 2.97-7.81eV. The energy barrier of the twofolded Si emission as SiO molecule is estimated to be 1.20eV on the basis of the enthalpy change in an MD simulation. The emitted SiO molecule is incorporated into the SiO2 network through a Si-O rebonding process with leaving local deficiency of oxygen, i.e., generating an oxygen vacancy. The energy barrier of the SiO incorporation is estimated to be 0.79-0.81eV. The elementary process of oxygen vacancy diffusion leading to the complete SiO incorporation are also simulated, and the energy barriers are found to be relatively small, 0.71-0.79eV. The energy changes of Si emissions into the substrate and SiO2 are larger than the energy barrier of the SiO emission, which suggests that, at the ideally flat Si/SiO2 interface with relatively small oxidation stress, the SiO emission into the SiO2 region occurs prior to the Si emission. This result is consistent with previous theoretical and experimental studies. The above-mentioned typical atomic processes are successfully extracted from some (or one) of MD simulations among many trials in which a statistical procedure is partly employed. Our results give a unified understanding of Si oxidation processes from an atomistic point of view. Takahashi et al. investigated the Si oxidation processes through Si and SiO emission from Si/SiO2 interfaces and the following incorporation into Si substrate and/or SiO2 layer. By employing molecular dynamics and static energy calculations, the emission processes of two-fold coordinated Si atoms formed at the interface due to the incorporation of oxygen atoms were investigated. The authors also investigated the mechanism of the SiO incorporation into the SiO2 network and the following oxygen vacancy diffusion by simulating the elementary processes. The results give an atomistic picture of the behavior of the Si species emitted from the Si/SiO2 interface during Si oxidation, leading to a unified understanding of Si oxidation processes.
AB - Si(100)-oxidation processes at the Si/SiO2 interface and in the SiO2 region are investigated focusing on the dynamics of Si and SiO emissions from the interface and the following incorporation into the substrate and/or SiO2. To clarify these atomic processes, classical molecular dynamics (MD) simulations with variable charge interatomic potentials are performed. By incorporating oxygen atoms, twofold coordinated (twofolded) Si atoms are formed after structural relaxation at the interface. The energy changes of the twofolded Si emissions into the substrate and SiO2 are estimated to be 2.97-7.81eV. The energy barrier of the twofolded Si emission as SiO molecule is estimated to be 1.20eV on the basis of the enthalpy change in an MD simulation. The emitted SiO molecule is incorporated into the SiO2 network through a Si-O rebonding process with leaving local deficiency of oxygen, i.e., generating an oxygen vacancy. The energy barrier of the SiO incorporation is estimated to be 0.79-0.81eV. The elementary process of oxygen vacancy diffusion leading to the complete SiO incorporation are also simulated, and the energy barriers are found to be relatively small, 0.71-0.79eV. The energy changes of Si emissions into the substrate and SiO2 are larger than the energy barrier of the SiO emission, which suggests that, at the ideally flat Si/SiO2 interface with relatively small oxidation stress, the SiO emission into the SiO2 region occurs prior to the Si emission. This result is consistent with previous theoretical and experimental studies. The above-mentioned typical atomic processes are successfully extracted from some (or one) of MD simulations among many trials in which a statistical procedure is partly employed. Our results give a unified understanding of Si oxidation processes from an atomistic point of view. Takahashi et al. investigated the Si oxidation processes through Si and SiO emission from Si/SiO2 interfaces and the following incorporation into Si substrate and/or SiO2 layer. By employing molecular dynamics and static energy calculations, the emission processes of two-fold coordinated Si atoms formed at the interface due to the incorporation of oxygen atoms were investigated. The authors also investigated the mechanism of the SiO incorporation into the SiO2 network and the following oxygen vacancy diffusion by simulating the elementary processes. The results give an atomistic picture of the behavior of the Si species emitted from the Si/SiO2 interface during Si oxidation, leading to a unified understanding of Si oxidation processes.
KW - Molecular dynamics simulations
KW - Si emission
KW - Si oxidation
KW - Si/SiO interface
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U2 - 10.1002/pssb.201400068
DO - 10.1002/pssb.201400068
M3 - Article
AN - SCOPUS:84911427165
SN - 0370-1972
VL - 251
SP - 2169
EP - 2178
JO - Physica Status Solidi (B): Basic Research
JF - Physica Status Solidi (B): Basic Research
IS - 11
ER -