TY - GEN
T1 - Molecular scale mechanism of thermal resistance at solid-liquid interfaces (influence of interaction parameters between solid and liquid molecules)
AU - Torii, Daichi
AU - Ohara, Taku
AU - Ishida, Kenji
PY - 2007/12/1
Y1 - 2007/12/1
N2 - Nonequilibrium molecular dynamics simulations have been performed for systems of a liquid film confined between atomistic solid walls. The two solid walls have different temperatures to generate a steady thermal energy flux in the system, which is the element of macroscopic heat conduction flux. Three kinds of liquid molecules and three kinds of solid walls are examined, and the thermal energy flux is measured at control surfaces in the liquid film and at the solid-liquid interfaces. By analyzing the thermal energy flux in detail by decomposing it into several molecular-scale contributions, influence of interaction parameters between solid and liquid molecules and the spacing of molecular alignment on the surface of the solid wall are clarified, and the molecular-scale mechanisms that govern the thermal resistance at a solid-liquid interface are elucidated.
AB - Nonequilibrium molecular dynamics simulations have been performed for systems of a liquid film confined between atomistic solid walls. The two solid walls have different temperatures to generate a steady thermal energy flux in the system, which is the element of macroscopic heat conduction flux. Three kinds of liquid molecules and three kinds of solid walls are examined, and the thermal energy flux is measured at control surfaces in the liquid film and at the solid-liquid interfaces. By analyzing the thermal energy flux in detail by decomposing it into several molecular-scale contributions, influence of interaction parameters between solid and liquid molecules and the spacing of molecular alignment on the surface of the solid wall are clarified, and the molecular-scale mechanisms that govern the thermal resistance at a solid-liquid interface are elucidated.
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U2 - 10.1115/HT2007-32391
DO - 10.1115/HT2007-32391
M3 - Conference contribution
AN - SCOPUS:43449108290
SN - 0791842746
SN - 9780791842744
T3 - 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
SP - 23
EP - 31
BT - 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
T2 - 2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
Y2 - 8 July 2007 through 12 July 2007
ER -