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Multichip-to-wafer three-dimensional integration technology using chip self-assembly with excimer lamp irradiation
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Research output: Contribution to journal › Article › peer-review
44
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(Scopus)