Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

Takafumi Fukushima

doi:10.1109/EDTM47692.2020.9117867

Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

Takafumi Fukushima

ENG - Mechanical Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.

Original language	English
Title of host publication	4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728125381
DOIs	https://doi.org/10.1109/EDTM47692.2020.9117867
Publication status	Published - 2020 Apr
Event	4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Penang, Malaysia Duration: 2020 Apr 6 → 2020 Apr 21

Publication series

Name	4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings

Conference

Conference	4th Electron Devices Technology and Manufacturing Conference, EDTM 2020
Country/Territory	Malaysia
City	Penang
Period	20/4/6 → 20/4/21

Keywords

3D integration
FHE
heterogeneous integration
massively parallel capillary self-assembly
micro-LED
multichip-to-wafer bonding

Access to Document

10.1109/EDTM47692.2020.9117867

Cite this

Fukushima, T. (2020). Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly. In 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings Article 9117867 (4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM47692.2020.9117867

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abstract = "We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.",

keywords = "3D integration, FHE, heterogeneous integration, massively parallel capillary self-assembly, micro-LED, multichip-to-wafer bonding",

author = "Takafumi Fukushima",

note = "Funding Information: This work was performed in the Micro/Nano-machining research and education Center (MNC), Jun-ichi Nishizawa Research Center, and Global INTegration Initiative (GINTI) in Tohoku University. Publisher Copyright: {\textcopyright} 2020 IEEE.; 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 ; Conference date: 06-04-2020 Through 21-04-2020",

year = "2020",

month = apr,

doi = "10.1109/EDTM47692.2020.9117867",

language = "English",

series = "4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings",

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}

Fukushima, T 2020, Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly. in 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings., 9117867, 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020, Penang, Malaysia, 20/4/6. https://doi.org/10.1109/EDTM47692.2020.9117867

Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly. / Fukushima, Takafumi.
4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. 9117867 (4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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N1 - Funding Information: This work was performed in the Micro/Nano-machining research and education Center (MNC), Jun-ichi Nishizawa Research Center, and Global INTegration Initiative (GINTI) in Tohoku University. Publisher Copyright: © 2020 IEEE.

PY - 2020/4

Y1 - 2020/4

N2 - We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.

AB - We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.

KW - 3D integration

KW - FHE

KW - heterogeneous integration

KW - massively parallel capillary self-assembly

KW - micro-LED

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M3 - Conference contribution

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ER -

Fukushima T. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly. In 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2020. 9117867. (4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings). doi: 10.1109/EDTM47692.2020.9117867

Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

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