Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application

M. Murugesan, K. Mori, T. Kojima, H. Hashimoto, J. C. Bea, T. Fukushima, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application'. Together they form a unique fingerprint.

Material Science