Nanoporous gold as a versatile bonding intermediate

Y. C. Lin; W. S. Wang; T. Gessner; M. Esashi

doi:10.1109/LTB-3D.2014.6886185

Nanoporous gold as a versatile bonding intermediate

Y. C. Lin, W. S. Wang, T. Gessner, M. Esashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

Original language	English
Title of host publication	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Publisher	IEEE Computer Society
Pages	46
Number of pages	1
ISBN (Print)	9781479952618
DOIs	https://doi.org/10.1109/LTB-3D.2014.6886185
Publication status	Published - 2014
Event	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16

Publication series

Name	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country/Territory	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

ASJC Scopus subject areas

Filtration and Separation

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10.1109/LTB-3D.2014.6886185

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Lin, Y. C., Wang, W. S., Gessner, T., & Esashi, M. (2014). Nanoporous gold as a versatile bonding intermediate. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 (pp. 46). [6886185] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886185

Nanoporous gold as a versatile bonding intermediate. / Lin, Y. C.; Wang, W. S.; Gessner, T. et al.
Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. p. 46 6886185 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lin, YC, Wang, WS, Gessner, T & Esashi, M 2014, Nanoporous gold as a versatile bonding intermediate. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886185, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, IEEE Computer Society, pp. 46, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886185

Lin YC, Wang WS, Gessner T, Esashi M. Nanoporous gold as a versatile bonding intermediate. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society. 2014. p. 46. 6886185. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). doi: 10.1109/LTB-3D.2014.6886185

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Nanoporous gold as a versatile bonding intermediate

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