NEMS/MEMS and passive components integration by using novel LTCC substrate

Jörg Frömel; Yu Ching Lin; Mamoru Mori; Shuji Tanaka; Thomas Gessner; Masayoshi Esashi

NEMS/MEMS and passive components integration by using novel LTCC substrate

Jörg Frömel, Yu Ching Lin, Mamoru Mori, Shuji Tanaka, Thomas Gessner, Masayoshi Esashi

Research output: Contribution to conference › Paper › peer-review

Abstract

A concept for a one chip tunable RF device has been presented. This concept uses a novel LTCC substrate with unique features that allow integration of passive electric components as well as MEMS and microelectronic devices. Key functionality of these LTCC is the to silicon matched thermal expansion coefficient and the ability for anodic bonding. New nanomaterial based passive devices are being used to reach a very high grade of miniaturization.

Original language	English
Publication status	Published - 2010
Event	Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components - Como, Italy Duration: 2010 Mar 23 → 2010 Mar 24

Conference

Conference	Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
Country/Territory	Italy
City	Como
Period	10/3/23 → 10/3/24

Cite this

@conference{19da91d1e16341bab3620f11562e9a7d,

title = "NEMS/MEMS and passive components integration by using novel LTCC substrate",

abstract = "A concept for a one chip tunable RF device has been presented. This concept uses a novel LTCC substrate with unique features that allow integration of passive electric components as well as MEMS and microelectronic devices. Key functionality of these LTCC is the to silicon matched thermal expansion coefficient and the ability for anodic bonding. New nanomaterial based passive devices are being used to reach a very high grade of miniaturization.",

author = "J{\"o}rg Fr{\"o}mel and Lin, {Yu Ching} and Mamoru Mori and Shuji Tanaka and Thomas Gessner and Masayoshi Esashi",

year = "2010",

language = "English",

note = "Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components ; Conference date: 23-03-2010 Through 24-03-2010",

}

NEMS/MEMS and passive components integration by using novel LTCC substrate. / Frömel, Jörg; Lin, Yu Ching; Mori, Mamoru et al.
2010. Paper presented at Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components, Como, Italy.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - NEMS/MEMS and passive components integration by using novel LTCC substrate

AU - Frömel, Jörg

AU - Lin, Yu Ching

AU - Mori, Mamoru

AU - Tanaka, Shuji

AU - Gessner, Thomas

AU - Esashi, Masayoshi

PY - 2010

Y1 - 2010

N2 - A concept for a one chip tunable RF device has been presented. This concept uses a novel LTCC substrate with unique features that allow integration of passive electric components as well as MEMS and microelectronic devices. Key functionality of these LTCC is the to silicon matched thermal expansion coefficient and the ability for anodic bonding. New nanomaterial based passive devices are being used to reach a very high grade of miniaturization.

AB - A concept for a one chip tunable RF device has been presented. This concept uses a novel LTCC substrate with unique features that allow integration of passive electric components as well as MEMS and microelectronic devices. Key functionality of these LTCC is the to silicon matched thermal expansion coefficient and the ability for anodic bonding. New nanomaterial based passive devices are being used to reach a very high grade of miniaturization.

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UR - http://www.scopus.com/inward/citedby.url?scp=84907406252&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84907406252

T2 - Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components

Y2 - 23 March 2010 through 24 March 2010

ER -

NEMS/MEMS and passive components integration by using novel LTCC substrate

Abstract

Conference

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