TY - GEN
T1 - New assembly technologies for Tjmax=175°C continuous operation guaranty of IGBT module
AU - Saito, T.
AU - Nishimura, Y.
AU - Kido, K.
AU - Momose, F.
AU - Mochizuki, E.
AU - Takahashi, Y.
PY - 2013/1/1
Y1 - 2013/1/1
N2 - In this paper, in order to realize the next generation IGBT module, the failure mechanisms of PC (power cycling) test at high operation temperature of Tjmax (maximum junction temperature) =175°C is investigated. From these detailed investigations, we have cleared that these failure modes are dominated by three major physical and mechanical phenomena under the categorized three temperature regions. By using these results, we have developed three new technologies for achieving higher PC capability: (a) New Al (Aluminium) wire with higher fatigue capability, (b) High strength solder at high temperature, (c) New die metallization with higher strength under high temperature and low thermal stress between Si (Silicon) die and Al wire. With these technologies, our new IGBT module has the excellent PC capability of continuous operation at Tjmax=175°C and longer lifetime compared with the conventional one.
AB - In this paper, in order to realize the next generation IGBT module, the failure mechanisms of PC (power cycling) test at high operation temperature of Tjmax (maximum junction temperature) =175°C is investigated. From these detailed investigations, we have cleared that these failure modes are dominated by three major physical and mechanical phenomena under the categorized three temperature regions. By using these results, we have developed three new technologies for achieving higher PC capability: (a) New Al (Aluminium) wire with higher fatigue capability, (b) High strength solder at high temperature, (c) New die metallization with higher strength under high temperature and low thermal stress between Si (Silicon) die and Al wire. With these technologies, our new IGBT module has the excellent PC capability of continuous operation at Tjmax=175°C and longer lifetime compared with the conventional one.
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M3 - Conference contribution
AN - SCOPUS:84897545444
SN - 9783800735051
T3 - PCIM Europe Conference Proceedings
SP - 455
EP - 461
BT - Proceedings - PCIM Europe 2013
PB - Mesago PCIM GmbH
T2 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2013
Y2 - 14 May 2013 through 16 May 2013
ER -