Abstract
We present a new paradigm of Si technologies to establish a gigahertz-operation gigascaie Integrated system large-scale integration (LSI), including digital and analog circuits. According to the theoretical analysis of high-speed signal propagation properties in the practical LSI structure, a gas-isolated-inlerconnect high-k gate dielectric metal-gate metal-substrate silicon-on-insulator (SOI) LSI structure is proposed as a possible solution for a future gigahertz CSI system LSI, where the clock rate is improved up to beyond 10 GHz and the minimum feature size is reduced down to 0.035 /im with keeping a continuous progress of the LSI's speed performance. Perfect scientific manufacturing free from fluctuations consisting of total low-temperature high-quality and high-speed processes based on very high-density plasma having very low electron temperatures is essential to realize them.
Original language | English |
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Pages (from-to) | 394-411 |
Number of pages | 18 |
Journal | Proceedings of the IEEE |
Volume | 89 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2001 |
Keywords
- Gas-isolated interconnect
- Gigahertz operation
- Gigascale integration
- High-density plasma
- Low-temperature high-quality and high-speed processing
- Metal-substrate soi
- Perfect scientific manufacturing free from fluctuations