New three-dimensional memory array architecture for future ultrahigh-density DRAM

Tetsuo Endoh, Katsuhisa Shinmei, Hiroshi Sakuraba, Fujio Masuoka

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)


In this paper, a three-dimensional (3-D) memory array architecture is proposed. This new architecture is realized by stacking several cells in series vertically on each cell located in a two-dimensional array matrix. Therefore, this memory array architecture has a conventional horizontal row and column address and new vertical row address. The total bit-line capacitance of this proposed architecture's DRAM is suppressed to 37% of normal DRAM when one bit-line has 1-Kbit cells and the same design rules are used. Moreover, an array area of 1-Mbit DRAM using the proposed architecture is reduced to 11.5% of normal DRAM using the same design rules. This proposed architecture's DRAM can realize small bit-line capacitance and small array area simultaneously. Therefore, this proposed 3-D memory array architecture is suitable for future ultrahigh-density DRAM.

Original languageEnglish
Pages (from-to)476-483
Number of pages8
JournalIEEE Journal of Solid-State Circuits
Issue number4
Publication statusPublished - 1999 Apr


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