Abstract
A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.
| Original language | English |
|---|---|
| Pages (from-to) | 1217-1221 |
| Number of pages | 5 |
| Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
| Volume | 37 |
| Issue number | 3 SUPPL. B |
| DOIs | |
| Publication status | Published - 1998 Mar |
| Externally published | Yes |
Keywords
- 3D wafer bonding technology
- Adhesive injection method
- Buried interconnection
- Chemical-mechanical polishing
- Wafer alignment
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)