TY - GEN
T1 - Nondestructive evaluation of the delamination of fine bumps in three-dimensionally stacked flip chip structures
AU - Sato, Yuhki
AU - Murata, Naokazu
AU - Tamakawa, Kinji
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2010
Y1 - 2010
N2 - A new nondestructive evaluation method for detecting delamination between a chip and metallic bumps in areaarrayed flip chip structures has been developed by measuring the local surface deformation of a chip, which is caused by the mismatch in mechanical properties between the metallic bumps and underfill. The change of the local deformation was measured by using a high resolution laser displacement meter and it was confirmed that the 3 μm-thick delamination can be detected easily using the proposed method.
AB - A new nondestructive evaluation method for detecting delamination between a chip and metallic bumps in areaarrayed flip chip structures has been developed by measuring the local surface deformation of a chip, which is caused by the mismatch in mechanical properties between the metallic bumps and underfill. The change of the local deformation was measured by using a high resolution laser displacement meter and it was confirmed that the 3 μm-thick delamination can be detected easily using the proposed method.
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U2 - 10.1109/ECTC.2010.5490684
DO - 10.1109/ECTC.2010.5490684
M3 - Conference contribution
AN - SCOPUS:77955205183
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1951
EP - 1956
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -