Nondestructive inspection of delamination in IC packages by high-frequency microwaves

Y. Ju, M. Saka, H. Abé

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


Delamination in IC packages was detected by microwaves. An open-ended coaxial line sensor was employed to couple microwave signals with the package and the package was scanned in two perpendicular directions on a plane parallel to the package. A microwave image was created by measuring the phase of the effective reflection coefficient at the aperture of the coaxial line sensor. A high-frequency microwave was used to obtain a higher spatial resolution. The image obtained from the microwave measurement shows almost the same features as that of a scanning acoustic tomograph. The delamination was detected significantly without a coupling medium. This indicates that microwave imaging is a promising technique for the integrity assessment of IC packages.

Original languageEnglish
Pages (from-to)213-217
Number of pages5
JournalNDT and E International
Issue number3
Publication statusPublished - 2001 Apr
Externally publishedYes

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering


Dive into the research topics of 'Nondestructive inspection of delamination in IC packages by high-frequency microwaves'. Together they form a unique fingerprint.

Cite this