Nondestructive inspection of delamination in IC packages by high-frequency microwaves

Y. Ju; M. Saka; H. Abé

doi:10.1016/S0963-8695(00)00059-1

Nondestructive inspection of delamination in IC packages by high-frequency microwaves

Y. Ju, M. Saka, H. Abé

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

Delamination in IC packages was detected by microwaves. An open-ended coaxial line sensor was employed to couple microwave signals with the package and the package was scanned in two perpendicular directions on a plane parallel to the package. A microwave image was created by measuring the phase of the effective reflection coefficient at the aperture of the coaxial line sensor. A high-frequency microwave was used to obtain a higher spatial resolution. The image obtained from the microwave measurement shows almost the same features as that of a scanning acoustic tomograph. The delamination was detected significantly without a coupling medium. This indicates that microwave imaging is a promising technique for the integrity assessment of IC packages.

Original language	English
Pages (from-to)	213-217
Number of pages	5
Journal	NDT and E International
Volume	34
Issue number	3
DOIs	https://doi.org/10.1016/S0963-8695(00)00059-1
Publication status	Published - 2001 Apr
Externally published	Yes

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanical Engineering

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10.1016/S0963-8695(00)00059-1

Cite this

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title = "Nondestructive inspection of delamination in IC packages by high-frequency microwaves",

abstract = "Delamination in IC packages was detected by microwaves. An open-ended coaxial line sensor was employed to couple microwave signals with the package and the package was scanned in two perpendicular directions on a plane parallel to the package. A microwave image was created by measuring the phase of the effective reflection coefficient at the aperture of the coaxial line sensor. A high-frequency microwave was used to obtain a higher spatial resolution. The image obtained from the microwave measurement shows almost the same features as that of a scanning acoustic tomograph. The delamination was detected significantly without a coupling medium. This indicates that microwave imaging is a promising technique for the integrity assessment of IC packages.",

author = "Y. Ju and M. Saka and H. Ab{\'e}",

note = "Funding Information: The authors would like to thank Mr. K. Oota of Sumitomo Bakelite Co., Ltd for preparing the package samples. This work was partly supported by: The Ministry of Education, Science, Sports and Culture under Grant-in-Aid for Encouragement of Young Scientists (A) 12750065, Scientific Research (B)(2) 11555025, and COE Research 11CE2003.",

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AU - Ju, Y.

AU - Saka, M.

AU - Abé, H.

N1 - Funding Information: The authors would like to thank Mr. K. Oota of Sumitomo Bakelite Co., Ltd for preparing the package samples. This work was partly supported by: The Ministry of Education, Science, Sports and Culture under Grant-in-Aid for Encouragement of Young Scientists (A) 12750065, Scientific Research (B)(2) 11555025, and COE Research 11CE2003.

PY - 2001/4

Y1 - 2001/4

N2 - Delamination in IC packages was detected by microwaves. An open-ended coaxial line sensor was employed to couple microwave signals with the package and the package was scanned in two perpendicular directions on a plane parallel to the package. A microwave image was created by measuring the phase of the effective reflection coefficient at the aperture of the coaxial line sensor. A high-frequency microwave was used to obtain a higher spatial resolution. The image obtained from the microwave measurement shows almost the same features as that of a scanning acoustic tomograph. The delamination was detected significantly without a coupling medium. This indicates that microwave imaging is a promising technique for the integrity assessment of IC packages.

AB - Delamination in IC packages was detected by microwaves. An open-ended coaxial line sensor was employed to couple microwave signals with the package and the package was scanned in two perpendicular directions on a plane parallel to the package. A microwave image was created by measuring the phase of the effective reflection coefficient at the aperture of the coaxial line sensor. A high-frequency microwave was used to obtain a higher spatial resolution. The image obtained from the microwave measurement shows almost the same features as that of a scanning acoustic tomograph. The delamination was detected significantly without a coupling medium. This indicates that microwave imaging is a promising technique for the integrity assessment of IC packages.

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Nondestructive inspection of delamination in IC packages by high-frequency microwaves

Abstract

ASJC Scopus subject areas

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