TY - GEN
T1 - Nonlinear spring tuning by electrostatic combs in micro mirror scanner
AU - Hane, Kazuhiro
AU - Izawa, Takashi
AU - Sasaki, Takashi
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/22
Y1 - 2018/6/22
N2 - Tuning of operation frequency of resonant-mode micro-mirror scanner is often needed for compensating fabrication errors. Moreover, the oscillation curve of the scanner often suffers a bend by a hard-spring effect of torsion bar. Combining an electrostatic comb spring with the torsion bar, the resonant frequency of the scanner is tuned and the hard spring nonlinearity is compensated. First, the theoretical approach is described. Next, from the experiments, it is shown that the proposed method is effective by applying DC and AC voltages to the electrostatic comb spring. The adjustments of the resonant frequency and the hard spring nonlinearity are useful for improving the operation characteristics of micro mirror scanner.
AB - Tuning of operation frequency of resonant-mode micro-mirror scanner is often needed for compensating fabrication errors. Moreover, the oscillation curve of the scanner often suffers a bend by a hard-spring effect of torsion bar. Combining an electrostatic comb spring with the torsion bar, the resonant frequency of the scanner is tuned and the hard spring nonlinearity is compensated. First, the theoretical approach is described. Next, from the experiments, it is shown that the proposed method is effective by applying DC and AC voltages to the electrostatic comb spring. The adjustments of the resonant frequency and the hard spring nonlinearity are useful for improving the operation characteristics of micro mirror scanner.
KW - Comb-drive actuator
KW - Silicon micro-mirror
KW - Spring non linearity
UR - http://www.scopus.com/inward/record.url?scp=85050209236&partnerID=8YFLogxK
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U2 - 10.1109/DTIP.2018.8394239
DO - 10.1109/DTIP.2018.8394239
M3 - Conference contribution
AN - SCOPUS:85050209236
T3 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
SP - 1
EP - 4
BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
A2 - Marcelli, Romolo
A2 - Mita, Yoshio
A2 - Smith, Stewart
A2 - Pressecq, Francis
A2 - Nouet, Pascal
A2 - Mailly, Frederick
A2 - Schneider, Peter
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
Y2 - 22 May 2018 through 25 May 2018
ER -