Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

Yuki Ohara; Kanuku Ri; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/3DIC.2012.6262950

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

Yuki Ohara, Kanuku Ri, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm ² size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.

Original language	English
Title of host publication	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs	https://doi.org/10.1109/3DIC.2012.6262950
Publication status	Published - 2011 Dec 1
Event	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: 2012 Jan 31 → 2012 Feb 2

Publication series

Name	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Country/Territory	Japan
City	Osaka
Period	12/1/31 → 12/2/2

ASJC Scopus subject areas

Control and Systems Engineering

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10.1109/3DIC.2012.6262950

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Ohara, Y., Ri, K., Fukushima, T., Tanaka, T., & Koyanagi, M. (2011). Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 [6262950] (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). https://doi.org/10.1109/3DIC.2012.6262950

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. / Ohara, Yuki; Ri, Kanuku; Fukushima, Takafumi et al.
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6262950 (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ohara, Y, Ri, K, Fukushima, T , Tanaka, T & Koyanagi, M 2011, Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6262950, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, Japan, 12/1/31. https://doi.org/10.1109/3DIC.2012.6262950

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title = "Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration",

abstract = "We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm 2 size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.",

author = "Yuki Ohara and Kanuku Ri and Takafumi Fukushima and Tetsu Tanaka and Mitsumasa Koyanagi",

year = "2011",

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doi = "10.1109/3DIC.2012.6262950",

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series = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

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AU - Ohara, Yuki

AU - Ri, Kanuku

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AU - Tanaka, Tetsu

AU - Koyanagi, Mitsumasa

PY - 2011/12/1

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N2 - We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm 2 size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.

AB - We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm 2 size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.

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T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

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Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

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