Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Kangwook Lee; Jichel Bea; Takafumi Fukushima; Suresh Ramalingam; Xin Wu; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/LED.2015.2502584

Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of a current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of ultra-high density CNP. Test element group (TEG) dies with 7-mm × 23 mm size are bonded to interposer wafer by a new hybrid bonding technology. Scaled electrodes with 3 μm diameter and 6 μm pitch are formed in each TEG chip. We confirmed for the first time that a huge number of electrodes of 4 309 200 are successfully connected in series with the joining yield of 100% due to the ultra-high density CNP.

Original language	English
Article number	7332922
Pages (from-to)	81-83
Number of pages	3
Journal	IEEE Electron Device Letters
Volume	37
Issue number	1
DOIs	https://doi.org/10.1109/LED.2015.2502584
Publication status	Published - 2016 Jan

Keywords

Cu nano-pillar (CNP)
exascale 2.5D/3D integration
extruded electrode
hybrid bonding

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/LED.2015.2502584

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abstract = "We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of a current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of ultra-high density CNP. Test element group (TEG) dies with 7-mm × 23 mm size are bonded to interposer wafer by a new hybrid bonding technology. Scaled electrodes with 3 μm diameter and 6 μm pitch are formed in each TEG chip. We confirmed for the first time that a huge number of electrodes of 4 309 200 are successfully connected in series with the joining yield of 100% due to the ultra-high density CNP.",

keywords = "Cu nano-pillar (CNP), exascale 2.5D/3D integration, extruded electrode, hybrid bonding",

author = "Kangwook Lee and Jichel Bea and Takafumi Fukushima and Suresh Ramalingam and Xin Wu and Tetsu Tanaka and Mitsumasa Koyanagi",

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AU - Ramalingam, Suresh

AU - Wu, Xin

AU - Tanaka, Tetsu

AU - Koyanagi, Mitsumasa

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Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Abstract

Keywords

ASJC Scopus subject areas

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