TY - GEN
T1 - Novel retinal prosthesis system with three dimensionally stacked LSI chip
AU - Watanabe, T.
AU - Kikuchi, H.
AU - Fukushima, T.
AU - Tomita, H.
AU - Sugano, E.
AU - Kurino, H.
AU - Tanaka, T.
AU - Tamai, M.
AU - Koyanagi, M.
PY - 2006
Y1 - 2006
N2 - We have proposed a novel retinal prosthesis system with three-dimensionally stacked retinal prosthesis chip. The retinal prosthesis chip consists of several LSI chips that are vertically stacked and electrically connected using three-dimensional integration technology. We fabricated retinal prosthesis chip including photodetectors and stimulus current generators. We confirmed that current waveform parameters can be varied by bias voltages. Implantable stimulus electrode array was also fabricated for the electrical stimulation of the retina. To evaluate optimal retinal stimulus current, electrically evoked potential (EEP) was recorded in animal experiments. The recorded waveform shows a similar behavior to the visually evoked potential (VEP) waveform, indicating possibilities that the electrical stimulation of the retina can restore visual sensation for the blind patients.
AB - We have proposed a novel retinal prosthesis system with three-dimensionally stacked retinal prosthesis chip. The retinal prosthesis chip consists of several LSI chips that are vertically stacked and electrically connected using three-dimensional integration technology. We fabricated retinal prosthesis chip including photodetectors and stimulus current generators. We confirmed that current waveform parameters can be varied by bias voltages. Implantable stimulus electrode array was also fabricated for the electrical stimulation of the retina. To evaluate optimal retinal stimulus current, electrically evoked potential (EEP) was recorded in animal experiments. The recorded waveform shows a similar behavior to the visually evoked potential (VEP) waveform, indicating possibilities that the electrical stimulation of the retina can restore visual sensation for the blind patients.
UR - http://www.scopus.com/inward/record.url?scp=61549101383&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=61549101383&partnerID=8YFLogxK
U2 - 10.1109/ESSDER.2006.307704
DO - 10.1109/ESSDER.2006.307704
M3 - Conference contribution
AN - SCOPUS:61549101383
SN - 1424403014
SN - 9781424403011
T3 - ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference
SP - 327
EP - 330
BT - ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference
PB - IEEE Computer Society
T2 - ESSDERC 2006 - 36th European Solid-State Device Research Conference
Y2 - 19 September 2006 through 21 September 2006
ER -