Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration

K. W. Lee; C. Nagai; J. C. Bea; T. Fukushima; T. Tanaka; M. Koyanagi; R. Suresh; X. Wu Xilinx

doi:10.1109/ECTC.2016.10

Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu Xilinx

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Citations (Scopus)

Abstract

We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of untra-fine size, ultra-high density CNP. Multi-number of TEG dies with 7mm x 23mm size are bonded to an interposer wafer by a new hybrid bonding technology. A huge number of electrodes of 4,309,200 composed of scaled electrodes with 3μm diameter and 6μm pitch are formed in each TEG die. We confirmed for the first time that 4,309,200 electrodes per die are successfully connected in series with the joining yield of 100% due to ultra-high density CNP.

Original language	English
Title of host publication	Proceedings - ECTC 2016
Subtitle of host publication	66th Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	350-355
Number of pages	6
ISBN (Electronic)	9781509012039
DOIs	https://doi.org/10.1109/ECTC.2016.10
Publication status	Published - 2016 Aug 16
Event	66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States Duration: 2016 May 31 → 2016 Jun 3

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2016-August
ISSN (Print)	0569-5503

Conference

Conference	66th IEEE Electronic Components and Technology Conference, ECTC 2016
Country/Territory	United States
City	Las Vegas
Period	16/5/31 → 16/6/3

Keywords

Cu nano-pillar (CNP)
Exascale 2.5D/3D integration
Extruded electrode
Hybrid bonding

Access to Document

10.1109/ECTC.2016.10

Cite this

Lee, K. W., Nagai, C., Bea, J. C., Fukushima, T., Tanaka, T., Koyanagi, M., Suresh, R., & Xilinx, X. W. (2016). Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (pp. 350-355). Article 7545455 (Proceedings - Electronic Components and Technology Conference; Vol. 2016-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.10

Lee, K. W. ; Nagai, C. ; Bea, J. C. et al. / Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration. Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 350-355 (Proceedings - Electronic Components and Technology Conference).

@inproceedings{df928dd9df3248e29d364b9f89dbbc41,

title = "Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration",

abstract = "We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of untra-fine size, ultra-high density CNP. Multi-number of TEG dies with 7mm x 23mm size are bonded to an interposer wafer by a new hybrid bonding technology. A huge number of electrodes of 4,309,200 composed of scaled electrodes with 3μm diameter and 6μm pitch are formed in each TEG die. We confirmed for the first time that 4,309,200 electrodes per die are successfully connected in series with the joining yield of 100% due to ultra-high density CNP.",

keywords = "Cu nano-pillar (CNP), Exascale 2.5D/3D integration, Extruded electrode, Hybrid bonding",

author = "Lee, {K. W.} and C. Nagai and Bea, {J. C.} and T. Fukushima and T. Tanaka and M. Koyanagi and R. Suresh and Xilinx, {X. Wu}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 66th IEEE Electronic Components and Technology Conference, ECTC 2016 ; Conference date: 31-05-2016 Through 03-06-2016",

year = "2016",

month = aug,

day = "16",

doi = "10.1109/ECTC.2016.10",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "350--355",

booktitle = "Proceedings - ECTC 2016",

address = "United States",

}

Lee, KW, Nagai, C, Bea, JC, Fukushima, T , Tanaka, T, Koyanagi, M, Suresh, R & Xilinx, XW 2016, Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration. in Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference., 7545455, Proceedings - Electronic Components and Technology Conference, vol. 2016-August, Institute of Electrical and Electronics Engineers Inc., pp. 350-355, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, Las Vegas, United States, 16/5/31. https://doi.org/10.1109/ECTC.2016.10

Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration. / Lee, K. W.; Nagai, C.; Bea, J. C. et al.
Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2016. p. 350-355 7545455 (Proceedings - Electronic Components and Technology Conference; Vol. 2016-August).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration

AU - Lee, K. W.

AU - Nagai, C.

AU - Bea, J. C.

AU - Fukushima, T.

AU - Tanaka, T.

AU - Koyanagi, M.

AU - Suresh, R.

AU - Xilinx, X. Wu

PY - 2016/8/16

Y1 - 2016/8/16

N2 - We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of untra-fine size, ultra-high density CNP. Multi-number of TEG dies with 7mm x 23mm size are bonded to an interposer wafer by a new hybrid bonding technology. A huge number of electrodes of 4,309,200 composed of scaled electrodes with 3μm diameter and 6μm pitch are formed in each TEG die. We confirmed for the first time that 4,309,200 electrodes per die are successfully connected in series with the joining yield of 100% due to ultra-high density CNP.

AB - We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of untra-fine size, ultra-high density CNP. Multi-number of TEG dies with 7mm x 23mm size are bonded to an interposer wafer by a new hybrid bonding technology. A huge number of electrodes of 4,309,200 composed of scaled electrodes with 3μm diameter and 6μm pitch are formed in each TEG die. We confirmed for the first time that 4,309,200 electrodes per die are successfully connected in series with the joining yield of 100% due to ultra-high density CNP.

KW - Cu nano-pillar (CNP)

KW - Exascale 2.5D/3D integration

KW - Extruded electrode

KW - Hybrid bonding

UR - http://www.scopus.com/inward/record.url?scp=84987849196&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84987849196&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2016.10

DO - 10.1109/ECTC.2016.10

M3 - Conference contribution

AN - SCOPUS:84987849196

T3 - Proceedings - Electronic Components and Technology Conference

SP - 350

EP - 355

BT - Proceedings - ECTC 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 66th IEEE Electronic Components and Technology Conference, ECTC 2016

Y2 - 31 May 2016 through 3 June 2016

ER -

Lee KW, Nagai C, Bea JC, Fukushima T , Tanaka T, Koyanagi M et al. Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2016. p. 350-355. 7545455. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2016.10

Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration

Abstract

Publication series

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this