Abstract
A practical structural design system for LSI packages has been developed based on object-oriented and graphic user interface technologies. An object-oriented technology is applied for creating product model-based analysis model (PBAM) which is independent of analytical method or tool. It is easy to create any CAE model from the PBAM. Graphical user interface is another effective technology for easy operation. Design engineers only have to select a model of interest and revise the dimensions or materials of the package, if necessary. As soon as they finish revising the input data, a CAE model such as finite element meshes are generated and the analysis starts automatically. The life of the solder joints, for example, is automatically evaluated and the results are displayed on a CRT. This system is very effective for designing new, highly reliable LSI packages in a short time.
| Original language | English |
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| Pages | 1/- |
| Publication status | Published - 1999 |
| Event | InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA Duration: 1999 Jun 13 → 1999 Jun 19 |
Conference
| Conference | InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' |
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| City | Maui, HI, USA |
| Period | 99/6/13 → 99/6/19 |