Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

B. Wang; S. Tanaka; B. Guo; G. Vereecke; S. Severi; A. Witvrouw; M. Wevers; I. De Wolf

doi:10.1109/IPFA.2012.6306325

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

B. Wang, S. Tanaka, B. Guo, G. Vereecke, S. Severi, A. Witvrouw, M. Wevers, I. De Wolf

ENG - Robotics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

MEMs typically have moving parts that are sensitive to the environmental pressure during operation. Many types of microsystem devices need vacuum in order to operate properly. However, making a high vacuum MEMS package, which maintains this vacuum over a long time, is difficult. Sources of gas inside a MEMS package are mainly due to external leakage or in-diffusion and/or internal materials outgassing. This paper reports on a systematical study of the outgassing properties of typical materials (Table 1) used for imec's polycrystalline silicon-germanium (poly-SiGe) based MEMS thin film vacuum package technology.

Original language	English
Title of host publication	2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
DOIs	https://doi.org/10.1109/IPFA.2012.6306325
Publication status	Published - 2012
Event	2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 - Singapore, Singapore Duration: 2012 Jul 2 → 2012 Jul 6

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference	2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
Country/Territory	Singapore
City	Singapore
Period	12/7/2 → 12/7/6

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10.1109/IPFA.2012.6306325

Cite this

Wang, B., Tanaka, S., Guo, B., Vereecke, G., Severi, S., Witvrouw, A., Wevers, M., & De Wolf, I. (2012). Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 Article 6306325 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2012.6306325

@inproceedings{6331d990bce94cdeb25be7a69dba9856,

title = "Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS",

abstract = "MEMs typically have moving parts that are sensitive to the environmental pressure during operation. Many types of microsystem devices need vacuum in order to operate properly. However, making a high vacuum MEMS package, which maintains this vacuum over a long time, is difficult. Sources of gas inside a MEMS package are mainly due to external leakage or in-diffusion and/or internal materials outgassing. This paper reports on a systematical study of the outgassing properties of typical materials (Table 1) used for imec's polycrystalline silicon-germanium (poly-SiGe) based MEMS thin film vacuum package technology.",

author = "B. Wang and S. Tanaka and B. Guo and G. Vereecke and S. Severi and A. Witvrouw and M. Wevers and {De Wolf}, I.",

year = "2012",

doi = "10.1109/IPFA.2012.6306325",

language = "English",

isbn = "9781467309806",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

booktitle = "2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012",

note = "2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 ; Conference date: 02-07-2012 Through 06-07-2012",

}

Wang, B, Tanaka, S, Guo, B, Vereecke, G, Severi, S, Witvrouw, A, Wevers, M & De Wolf, I 2012, Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012., 6306325, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012, Singapore, Singapore, 12/7/2. https://doi.org/10.1109/IPFA.2012.6306325

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. / Wang, B.; Tanaka, S.; Guo, B. et al.
2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012. 2012. 6306325 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

AU - Wang, B.

AU - Tanaka, S.

AU - Guo, B.

AU - Vereecke, G.

AU - Severi, S.

AU - Witvrouw, A.

AU - Wevers, M.

AU - De Wolf, I.

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AB - MEMs typically have moving parts that are sensitive to the environmental pressure during operation. Many types of microsystem devices need vacuum in order to operate properly. However, making a high vacuum MEMS package, which maintains this vacuum over a long time, is difficult. Sources of gas inside a MEMS package are mainly due to external leakage or in-diffusion and/or internal materials outgassing. This paper reports on a systematical study of the outgassing properties of typical materials (Table 1) used for imec's polycrystalline silicon-germanium (poly-SiGe) based MEMS thin film vacuum package technology.

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T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

BT - 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012

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Y2 - 2 July 2012 through 6 July 2012

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Wang B, Tanaka S, Guo B, Vereecke G, Severi S, Witvrouw A et al. Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012. 2012. 6306325. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2012.6306325

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

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