| Original language | English |
|---|---|
| Pages (from-to) | 464-468 |
| Number of pages | 5 |
| Journal | Journal of Japan Institute of Electronics Packaging |
| Volume | 17 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2014 |
Packaging technology for high temperature operation of power semiconductor modules
Akira Morozumi, Yoshitaka Nishimura, Yoshinari Ikeda, Eiji Mochizuki, Yoshikazu Takahashi
Research output: Contribution to journal › Article › peer-review
1
Citation
(Scopus)