TY - GEN
T1 - Passive 2.45 GHz TDMA based multi-sensor wireless temperature monitoring system
T2 - Results and design considerations
AU - Kuypers, J. H.
AU - Tanaka, S.
AU - Esashi, M.
AU - Eisele, D. A.
AU - Reindl, L. M.
PY - 2006
Y1 - 2006
N2 - This paper presents a TDMA (time division multiple access) based wireless temperature monitoring system using 2.45 GHz passive surface acoustic wave (SAW) delay line sensors. A three-step resolution refinement scheme using a combined delay and phase evaluation is proposed. Using a transmission power of 2 dBm (1.59 mW) a temperature accuracy of 0.19 K and 0.1 K (6σ), were achieved for an interrogation distance of 1.4 m, and 1.3 m, respectively. The sensor design is discussed using experimental results concerning the relationship between the SNR (signal to noise ratio) of the sensors and the accuracy in time delay or phase measurement. Also, the direct electron beam writing on chemically-reduced (black) LiNbO3 is described.
AB - This paper presents a TDMA (time division multiple access) based wireless temperature monitoring system using 2.45 GHz passive surface acoustic wave (SAW) delay line sensors. A three-step resolution refinement scheme using a combined delay and phase evaluation is proposed. Using a transmission power of 2 dBm (1.59 mW) a temperature accuracy of 0.19 K and 0.1 K (6σ), were achieved for an interrogation distance of 1.4 m, and 1.3 m, respectively. The sensor design is discussed using experimental results concerning the relationship between the SNR (signal to noise ratio) of the sensors and the accuracy in time delay or phase measurement. Also, the direct electron beam writing on chemically-reduced (black) LiNbO3 is described.
KW - Delay line sensors
KW - K-Model
KW - SNR (signal to noise ratio)
KW - TDMA
KW - Wireless SAW sensors
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U2 - 10.1109/ULTSYM.2006.366
DO - 10.1109/ULTSYM.2006.366
M3 - Conference contribution
AN - SCOPUS:78649376630
SN - 1424402018
SN - 9781424402014
T3 - Proceedings - IEEE Ultrasonics Symposium
SP - 1453
EP - 1458
BT - 2006 IEEE International Ultrasonics Symposium, IUS
ER -