TY - GEN
T1 - Performance of integrated magnetic thin film noise suppressor applied to CMOS noise test chips
AU - Yamaguchi, Masahiro
AU - Muroga, Sho
AU - Endo, Yasushi
AU - Kodate, Wataru
AU - Yoshikawa, Kumpei
AU - Sasaki, Yuta
AU - Nagata, Makoto
PY - 2011
Y1 - 2011
N2 - Performance of soft magnetic CoZrNb film as a thin film noise suppressor and its application to an noise emulator chip fabricated by 90/65nm CMOS technology are discussed. Intra-chip decoupling was studied by the electromagnetic coupling between two miniature coils made on a noise test chip implemented in CMOS 90nm technology. Inter-chip decoupling (radiation) was evaluated by the coupling between parallel line currents implemented in CMOS 65nm technology chip and off-chip planar shielded-loop coil type miniature magnetic probe. The intra-decoupling was as large as 10 dB at 1.8 GHz where ferromagnetic resonance can be maximized. The inter-decoupling was 7.7 dB at 200 MHz where magnetic shielding is effective. It is found that the product of magnetic film thickness and permeability is a good measure to evaluate magnetic shielding effectiveness for IC chip level inter-decoupling.
AB - Performance of soft magnetic CoZrNb film as a thin film noise suppressor and its application to an noise emulator chip fabricated by 90/65nm CMOS technology are discussed. Intra-chip decoupling was studied by the electromagnetic coupling between two miniature coils made on a noise test chip implemented in CMOS 90nm technology. Inter-chip decoupling (radiation) was evaluated by the coupling between parallel line currents implemented in CMOS 65nm technology chip and off-chip planar shielded-loop coil type miniature magnetic probe. The intra-decoupling was as large as 10 dB at 1.8 GHz where ferromagnetic resonance can be maximized. The inter-decoupling was 7.7 dB at 200 MHz where magnetic shielding is effective. It is found that the product of magnetic film thickness and permeability is a good measure to evaluate magnetic shielding effectiveness for IC chip level inter-decoupling.
KW - analog-digital integrated circuits
KW - crosstalk magnetic shielding
KW - mobile communication
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M3 - Conference contribution
AN - SCOPUS:84855816058
SN - 9782874870224
T3 - European Microwave Week 2011: "Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011
SP - 49
EP - 52
BT - European Microwave Week 2011
T2 - 14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011
Y2 - 10 October 2011 through 13 October 2011
ER -