TY - GEN
T1 - Piezoelectric acoustic wave devices based on heterogeneous integration technology
AU - Tanaka, Shuji
PY - 2014
Y1 - 2014
N2 - Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.
AB - Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.
UR - http://www.scopus.com/inward/record.url?scp=84906871347&partnerID=8YFLogxK
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U2 - 10.1109/FCS.2014.6859994
DO - 10.1109/FCS.2014.6859994
M3 - Conference contribution
AN - SCOPUS:84906871347
SN - 9781479949168
T3 - IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings
BT - IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings
PB - IEEE Computer Society
T2 - 2014 IEEE International Frequency Control Symposium, IFCS 2014
Y2 - 19 May 2014 through 22 May 2014
ER -