Abstract
We have developed one-dimensional and two-dimensional push/pull-receptacle-type vertical-cavity surface-emitting laser (VCSEL)-array modules. The one-dimensional (1-D) 8-channel module connects with a conventional mechanically-transferable multifiber push-on (MPO) fiber connector. For the two-dimensional (2-D) 16-channel module, we developed an 8×2 2-D push/pull fiber connector. These modules employ plastic-based receptacle packages directly joined to the fiber connector. After the VCSEL-array chip was self-aligned to the Si substrate by using flip-chip bonding, the substrate was also self-aligned to the package by using a self-alignment mounting machine. Optical coupling losses for the 1-D and the 2-D modules were respectively 2.1±0.4 and 2.1±0.8 dB. The modules were operated at a bit rate of 1 Gbps/ch without an isolator and showed floorless BER performance up to 70 °C. At 1 Gbps/ch their optical sensitivities were respectively -25.0 dBm±1.0 dB and -26.0 dBm±0.9 dB. These structures and techniques are applicable to high-density, high-throughput interconnection.
| Original language | English |
|---|---|
| Pages (from-to) | 382-390 |
| Number of pages | 9 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Publication status | Published - 1997 Jan 1 |
| Event | Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA Duration: 1997 May 18 → 1997 May 21 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering