Poly-SiGe-based MEMS thin-film encapsulation

Bin Guo; Bo Wang; Lianggong Wen; Philippe Helin; Gert Claes; Jeroen De Coster; Bert Du Bois; Agnes Verbist; Rita Van Hoof; Guy Vereecke; Luc Haspeslagh; Harrie A.C. Tilmans; Stefaan Decoutere; Haris Osman; Robert Puers; Ingrid De Wolf; Shuji Tanaka; Simone Severi; Ann Witvrouw

doi:10.1109/JMEMS.2011.2170823

Poly-SiGe-based MEMS thin-film encapsulation

Bin Guo, Bo Wang, Lianggong Wen, Philippe Helin, Gert Claes, Jeroen De Coster, Bert Du Bois, Agnes Verbist, Rita Van Hoof, Guy Vereecke, Luc Haspeslagh, Harrie A.C. Tilmans, Stefaan Decoutere, Haris Osman, Robert Puers, Ingrid De Wolf, Shuji Tanaka, Simone Severi, Ann Witvrouw

ENG - Robotics

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

Abstract

This paper presents an attractive poly-SiGe thin-film packaging and MEM (microelectromechanical) platform technology for the generic integration of various packaged MEM devices above standard CMOS. Hermetic packages with sizes up to 1 mm ² and different sealed-in pressures ( ∼100 kPa and ∼2 kPa) are demonstrated. The use of a porous cover on top of the release holes avoids deposition inside the cavity during sealing, but leads to a sealed-in pressure of approximately 100 kPa, i.e. atmospheric pressure. Vacuum (∼2 kPa) sealing has been achieved by direct deposition of a sealing material on the SiGe capping layer. Packaged functional accelerometers sealed at around 100 kPa have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device. Vacuum-sealed beam resonators survive a 1000 h 85°C/85% RH highly accelerated storage test and 1000 thermal cycles between-40 °C and 150 °C.

Original language	English
Article number	6070940
Pages (from-to)	110-120
Number of pages	11
Journal	Journal of Microelectromechanical Systems
Volume	21
Issue number	1
DOIs	https://doi.org/10.1109/JMEMS.2011.2170823
Publication status	Published - 2012 Feb

Keywords

Hermeticity
poly-SiGe
thin-film packaging
vacuum sealing

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/JMEMS.2011.2170823

Cite this

Guo, B., Wang, B., Wen, L., Helin, P., Claes, G., De Coster, J., Du Bois, B., Verbist, A., Van Hoof, R., Vereecke, G., Haspeslagh, L., Tilmans, H. A. C., Decoutere, S., Osman, H., Puers, R., De Wolf, I., Tanaka, S., Severi, S., & Witvrouw, A. (2012). Poly-SiGe-based MEMS thin-film encapsulation. Journal of Microelectromechanical Systems, 21(1), 110-120. [6070940]. https://doi.org/10.1109/JMEMS.2011.2170823

Guo, B, Wang, B, Wen, L, Helin, P, Claes, G, De Coster, J, Du Bois, B, Verbist, A, Van Hoof, R, Vereecke, G, Haspeslagh, L, Tilmans, HAC, Decoutere, S, Osman, H, Puers, R, De Wolf, I, Tanaka, S, Severi, S & Witvrouw, A 2012, 'Poly-SiGe-based MEMS thin-film encapsulation', Journal of Microelectromechanical Systems, vol. 21, no. 1, 6070940, pp. 110-120. https://doi.org/10.1109/JMEMS.2011.2170823

@article{87caf6ef2cfd48fd8d72550ca294a416,

title = "Poly-SiGe-based MEMS thin-film encapsulation",

abstract = "This paper presents an attractive poly-SiGe thin-film packaging and MEM (microelectromechanical) platform technology for the generic integration of various packaged MEM devices above standard CMOS. Hermetic packages with sizes up to 1 mm 2 and different sealed-in pressures ( ∼100 kPa and ∼2 kPa) are demonstrated. The use of a porous cover on top of the release holes avoids deposition inside the cavity during sealing, but leads to a sealed-in pressure of approximately 100 kPa, i.e. atmospheric pressure. Vacuum (∼2 kPa) sealing has been achieved by direct deposition of a sealing material on the SiGe capping layer. Packaged functional accelerometers sealed at around 100 kPa have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device. Vacuum-sealed beam resonators survive a 1000 h 85°C/85% RH highly accelerated storage test and 1000 thermal cycles between-40 °C and 150 °C.",

keywords = "Hermeticity, poly-SiGe, thin-film packaging, vacuum sealing",

author = "Bin Guo and Bo Wang and Lianggong Wen and Philippe Helin and Gert Claes and {De Coster}, Jeroen and {Du Bois}, Bert and Agnes Verbist and {Van Hoof}, Rita and Guy Vereecke and Luc Haspeslagh and Tilmans, {Harrie A.C.} and Stefaan Decoutere and Haris Osman and Robert Puers and {De Wolf}, Ingrid and Shuji Tanaka and Simone Severi and Ann Witvrouw",

note = "Funding Information: Manuscript received May 11, 2011; revised July 19, 2011; accepted August 27, 2011. Date of publication November 7, 2011; date of current version February 3, 2012. This work was supported in part by the Flemish government through the IWT-SBO project GEMINI (“Generic Electronics and Microsystems Integration Initiative”), IWT-nr 60046, 2007–2011. The work of S. Tanaka was supported by the Japan Society for the Promotion of Science (JSPS) through its “Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program).” Subject Editor R. T. Howe.",

year = "2012",

month = feb,

doi = "10.1109/JMEMS.2011.2170823",

language = "English",

volume = "21",

pages = "110--120",

journal = "Journal of Microelectromechanical Systems",

issn = "1057-7157",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

TY - JOUR

T1 - Poly-SiGe-based MEMS thin-film encapsulation

AU - Guo, Bin

AU - Wang, Bo

AU - Wen, Lianggong

AU - Helin, Philippe

AU - Claes, Gert

AU - De Coster, Jeroen

AU - Du Bois, Bert

AU - Verbist, Agnes

AU - Van Hoof, Rita

AU - Vereecke, Guy

AU - Haspeslagh, Luc

AU - Tilmans, Harrie A.C.

AU - Decoutere, Stefaan

AU - Osman, Haris

AU - Puers, Robert

AU - De Wolf, Ingrid

AU - Tanaka, Shuji

AU - Severi, Simone

AU - Witvrouw, Ann

N1 - Funding Information: Manuscript received May 11, 2011; revised July 19, 2011; accepted August 27, 2011. Date of publication November 7, 2011; date of current version February 3, 2012. This work was supported in part by the Flemish government through the IWT-SBO project GEMINI (“Generic Electronics and Microsystems Integration Initiative”), IWT-nr 60046, 2007–2011. The work of S. Tanaka was supported by the Japan Society for the Promotion of Science (JSPS) through its “Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program).” Subject Editor R. T. Howe.

PY - 2012/2

Y1 - 2012/2

N2 - This paper presents an attractive poly-SiGe thin-film packaging and MEM (microelectromechanical) platform technology for the generic integration of various packaged MEM devices above standard CMOS. Hermetic packages with sizes up to 1 mm 2 and different sealed-in pressures ( ∼100 kPa and ∼2 kPa) are demonstrated. The use of a porous cover on top of the release holes avoids deposition inside the cavity during sealing, but leads to a sealed-in pressure of approximately 100 kPa, i.e. atmospheric pressure. Vacuum (∼2 kPa) sealing has been achieved by direct deposition of a sealing material on the SiGe capping layer. Packaged functional accelerometers sealed at around 100 kPa have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device. Vacuum-sealed beam resonators survive a 1000 h 85°C/85% RH highly accelerated storage test and 1000 thermal cycles between-40 °C and 150 °C.

AB - This paper presents an attractive poly-SiGe thin-film packaging and MEM (microelectromechanical) platform technology for the generic integration of various packaged MEM devices above standard CMOS. Hermetic packages with sizes up to 1 mm 2 and different sealed-in pressures ( ∼100 kPa and ∼2 kPa) are demonstrated. The use of a porous cover on top of the release holes avoids deposition inside the cavity during sealing, but leads to a sealed-in pressure of approximately 100 kPa, i.e. atmospheric pressure. Vacuum (∼2 kPa) sealing has been achieved by direct deposition of a sealing material on the SiGe capping layer. Packaged functional accelerometers sealed at around 100 kPa have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device. Vacuum-sealed beam resonators survive a 1000 h 85°C/85% RH highly accelerated storage test and 1000 thermal cycles between-40 °C and 150 °C.

KW - Hermeticity

KW - poly-SiGe

KW - thin-film packaging

KW - vacuum sealing

UR - http://www.scopus.com/inward/record.url?scp=84858439558&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84858439558&partnerID=8YFLogxK

U2 - 10.1109/JMEMS.2011.2170823

DO - 10.1109/JMEMS.2011.2170823

M3 - Article

AN - SCOPUS:84858439558

SN - 1057-7157

VL - 21

SP - 110

EP - 120

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

IS - 1

M1 - 6070940

ER -

Poly-SiGe-based MEMS thin-film encapsulation

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this