Precipitation behavior of Cu-atom-implanted Al single-crystalline films

S. Yamaguchi, T. Matsui, K. Takahiro, S. Nagata, Y. Kasukabe, Y. Yamada

Research output: Contribution to journalArticlepeer-review


The precipitation behavior of Cu-implanted Al films has been studied using electron microscopy and electron diffraction. The results show that two kinds of new intermediate precipitates are formed by aging at different temperatures. High temperature aging (about 300 °C) produces a large precipitate with an Ni4Mo-type structure, while aging at low temperature (about 130 °C) gives a precipitate with a modulated Pt2Mo-type structure, which nucleates on subgrain boundaries.

Original languageEnglish
Pages (from-to)255-259
Number of pages5
JournalSurface and Coatings Technology
Issue number1-3
Publication statusPublished - 1994 Aug


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