Precise micro-nanomachining for advanced sensors

Masayoshi Esashi; Takahito Ono; Kazuyuki Minami

doi:10.1117/12.284499

Precise micro-nanomachining for advanced sensors

Masayoshi Esashi, Takahito Ono, Kazuyuki Minami

ENG - Mechanical Systems Engineering

Tohoku University

Research output: Contribution to journal › Conference article › peer-review

Abstract

Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion-free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RE, XeF₂ silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.

Original language	English
Pages (from-to)	44-55
Number of pages	12
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3223
DOIs	https://doi.org/10.1117/12.284499
Publication status	Published - 1997
Event	Micromachining and Microfabrication Process Technology III - Austin, TX, United States Duration: 1997 Sept 29 → 1997 Sept 29

Keywords

Accelerometers
AFM probes
Angular rate sensors
Capacitive sensors
Micromachining
Nanomachining
Pressure sensors
Resonant sensors
Sensor packaging
Vacuum sensors

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title = "Precise micro-nanomachining for advanced sensors",

abstract = "Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion-free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RE, XeF2 silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.",

keywords = "Accelerometers, AFM probes, Angular rate sensors, Capacitive sensors, Micromachining, Nanomachining, Pressure sensors, Resonant sensors, Sensor packaging, Vacuum sensors",

author = "Masayoshi Esashi and Takahito Ono and Kazuyuki Minami",

year = "1997",

doi = "10.1117/12.284499",

language = "English",

volume = "3223",

pages = "44--55",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Micromachining and Microfabrication Process Technology III ; Conference date: 29-09-1997 Through 29-09-1997",

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TY - JOUR

T1 - Precise micro-nanomachining for advanced sensors

AU - Esashi, Masayoshi

AU - Ono, Takahito

AU - Minami, Kazuyuki

PY - 1997

Y1 - 1997

N2 - Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion-free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RE, XeF2 silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.

AB - Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion-free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RE, XeF2 silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.

KW - Accelerometers

KW - AFM probes

KW - Angular rate sensors

KW - Capacitive sensors

KW - Micromachining

KW - Nanomachining

KW - Pressure sensors

KW - Resonant sensors

KW - Sensor packaging

KW - Vacuum sensors

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U2 - 10.1117/12.284499

DO - 10.1117/12.284499

M3 - Conference article

AN - SCOPUS:57649149718

SN - 0277-786X

VL - 3223

SP - 44

EP - 55

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Micromachining and Microfabrication Process Technology III

Y2 - 29 September 1997 through 29 September 1997

ER -

Precise micro-nanomachining for advanced sensors

Abstract

Keywords

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