Precise micro-nanomachining for advanced sensors

Masayoshi Esashi, Takahito Ono, Kazuyuki Minami

Research output: Contribution to journalConference articlepeer-review


Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion-free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RE, XeF2 silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.

Original languageEnglish
Pages (from-to)44-55
Number of pages12
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - 1997
EventMicromachining and Microfabrication Process Technology III - Austin, TX, United States
Duration: 1997 Sept 291997 Sept 29


  • Accelerometers
  • AFM probes
  • Angular rate sensors
  • Capacitive sensors
  • Micromachining
  • Nanomachining
  • Pressure sensors
  • Resonant sensors
  • Sensor packaging
  • Vacuum sensors


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