Precise Micro-Nanomachining of Silicon

Masayoshi Esashi; Risaku Toda; Kazuyuki Minami; Takahito Ono

doi:10.1541/ieejsmas.119.489

Precise Micro-Nanomachining of Silicon

Masayoshi Esashi, Risaku Toda, Kazuyuki Minami, Takahito Ono

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF₂ silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.

Original language	English
Pages (from-to)	489-497
Number of pages	9
Journal	IEEJ Transactions on Sensors and Micromachines
Volume	119
Issue number	10
DOIs	https://doi.org/10.1541/ieejsmas.119.489
Publication status	Published - 1999

Keywords

Bulk-Micromachining
Microsensors
Nanomachining
Precise-Micromachining

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

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10.1541/ieejsmas.119.489

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title = "Precise Micro-Nanomachining of Silicon",

abstract = "Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF2 silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.",

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T1 - Precise Micro-Nanomachining of Silicon

AU - Esashi, Masayoshi

AU - Toda, Risaku

AU - Minami, Kazuyuki

AU - Ono, Takahito

PY - 1999

Y1 - 1999

N2 - Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF2 silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.

AB - Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF2 silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.

KW - Bulk-Micromachining

KW - Microsensors

KW - Nanomachining

KW - Precise-Micromachining

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Precise Micro-Nanomachining of Silicon

Abstract

Keywords

ASJC Scopus subject areas

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