TY - GEN
T1 - Prediction of electromigration failure in passivated polycrystalline line considering passivation thickness
AU - Sasagawa, Kazuhiko
AU - Hasegawa, Masataka
AU - Yoshida, Naoki
AU - Saka, Masumi
AU - Abé, Hiroyuki
PY - 2003
Y1 - 2003
N2 - It is known that the lifetime of the passivated metal line varies depending on kind and thickness of the passivation layer. The appropriate consideration of the effect of passivation on electromigration damage makes it possible to evaluate the reliability of the metal line with choosing kind or thickness of the passivation. This paper is focused on the effect of passivation thickness on the failure prediction. The failure prediction considering the passivation thickness is shown. First, the film characteristic constants depending on the passivation thickness are experimentally determined in the lines with three kinds of passivation thickness. Next, by extrapolating the obtained dependencies, the characteristic constants are determined to predict the lifetime of the line covered with the thicker passivation than that employed in the experiment, and the lifetime is predicted by the reliability evaluation method based on the numerical simulation.
AB - It is known that the lifetime of the passivated metal line varies depending on kind and thickness of the passivation layer. The appropriate consideration of the effect of passivation on electromigration damage makes it possible to evaluate the reliability of the metal line with choosing kind or thickness of the passivation. This paper is focused on the effect of passivation thickness on the failure prediction. The failure prediction considering the passivation thickness is shown. First, the film characteristic constants depending on the passivation thickness are experimentally determined in the lines with three kinds of passivation thickness. Next, by extrapolating the obtained dependencies, the characteristic constants are determined to predict the lifetime of the line covered with the thicker passivation than that employed in the experiment, and the lifetime is predicted by the reliability evaluation method based on the numerical simulation.
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U2 - 10.1115/ipack2003-35065
DO - 10.1115/ipack2003-35065
M3 - Conference contribution
AN - SCOPUS:1242264476
SN - 0791836908
SN - 9780791836903
T3 - Advances in Electronic Packaging
SP - 723
EP - 728
BT - Advances in Electronic Packaging 2003
PB - American Society of Mechanical Engineers
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
Y2 - 6 July 2003 through 11 July 2003
ER -