Progress and perspective of optical MEMS packaging technology

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	558-566
Number of pages	9
Journal	Journal of Japan Institute of Electronics Packaging
Volume	21
Issue number	6
DOIs	https://doi.org/10.5104/jiep.21.558
Publication status	Published - 2018 Sept

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title = "Progress and perspective of optical MEMS packaging technology",

author = "Renshi Sawada and Hirofumi Nogami and Eiji Higurashi",

year = "2018",

month = sep,

doi = "10.5104/jiep.21.558",

language = "English",

volume = "21",

pages = "558--566",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "6",

}

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AU - Sawada, Renshi

AU - Nogami, Hirofumi

AU - Higurashi, Eiji

PY - 2018/9

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JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

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