TY - GEN
T1 - Properties of Poly-Si Thin films and Their Transistors Fabricated Using Selective Excimer Laser Annealing
AU - Goto, Tetsuya
AU - Saito, Kaori
AU - Imaizumi, Fuminobu
AU - Hatanaka, Makoto
AU - Takimoto, Masami
AU - Mizumura, Michinobu
AU - Gotoh, Jun
AU - Ikenouc, Hirosi
AU - Udagawa, Kazuo
AU - Kido, Junji
AU - Sugawa, Shigetoshi
N1 - Publisher Copyright:
© 2018 FTFMD.
PY - 2018/8/15
Y1 - 2018/8/15
N2 - Selective laser annealing system was developed, and applied to fabricate low temperature poly-Si thin film transistors. The new system performs the laser annealing only for the selective area of TFT region by adopting micro lens array, which can apply the laser annealing even for large substrate, contrary to the conventional excimer laser annealing system having the limitation in substrate size due to the difficulty in obtaining uniform beam line. In this study, selectively-annealed poly-Si film structure and their TFT performance were investigated. Grain size increased as an increase in the laser energy density, and TFTs with the field effect mobility larger than 100 cm2V-1s-1 with the on-off ratio of drain current of 106 or more could be obtained.
AB - Selective laser annealing system was developed, and applied to fabricate low temperature poly-Si thin film transistors. The new system performs the laser annealing only for the selective area of TFT region by adopting micro lens array, which can apply the laser annealing even for large substrate, contrary to the conventional excimer laser annealing system having the limitation in substrate size due to the difficulty in obtaining uniform beam line. In this study, selectively-annealed poly-Si film structure and their TFT performance were investigated. Grain size increased as an increase in the laser energy density, and TFTs with the field effect mobility larger than 100 cm2V-1s-1 with the on-off ratio of drain current of 106 or more could be obtained.
UR - http://www.scopus.com/inward/record.url?scp=85053136430&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85053136430&partnerID=8YFLogxK
U2 - 10.23919/AM-FPD.2018.8437391
DO - 10.23919/AM-FPD.2018.8437391
M3 - Conference contribution
AN - SCOPUS:85053136430
SN - 9784990875350
T3 - AM-FPD 2018 - 25th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings
BT - AM-FPD 2018 - 25th International Workshop on Active-Matrix Flatpanel Displays and Devices
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th International Workshop on Active-Matrix Flatpanel Displays and Devices - TFT Technologies and FPD Materials, AM-FPD 2018
Y2 - 3 July 2018 through 6 July 2018
ER -