Properties of various plasma surface treatments for low-temperature Au-Au bonding

Michitaka Yamamoto; Eiji Higurashi; Tadatomo Suga; Renshi Sawada; Toshihiro Itoh

doi:10.7567/JJAP.57.04FC12

Properties of various plasma surface treatments for low-temperature Au-Au bonding

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

Atmospheric-pressure (AP) plasma treatment using three different types of gases (an argon-hydrogen mixed gas, an argon-oxygen mixed gas, and a nitrogen gas) and low-pressure (LP) plasma treatment using an argon gas were compared for Au-Au bonding with thin films and stud bumps at low temperature (25 or 150 °C) in ambient air. The argon-hydrogen gas mixture AP plasma treatment and argon LP plasma treatment were found to distinctly increase the shear bond strength for both samples at both temperatures. From X-ray photoelectron spectroscopy (XPS) analysis, the removal of organic contaminants on Au surfaces without the formation of hydroxyl groups and gold oxide is considered effective in increasing the Au-Au bonding strength at low temperature.

Original language	English
Article number	04FC12
Journal	Japanese journal of applied physics
Volume	57
Issue number	4
DOIs	https://doi.org/10.7567/JJAP.57.04FC12
Publication status	Published - 2018 Apr
Externally published	Yes

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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title = "Properties of various plasma surface treatments for low-temperature Au-Au bonding",

abstract = "Atmospheric-pressure (AP) plasma treatment using three different types of gases (an argon-hydrogen mixed gas, an argon-oxygen mixed gas, and a nitrogen gas) and low-pressure (LP) plasma treatment using an argon gas were compared for Au-Au bonding with thin films and stud bumps at low temperature (25 or 150 °C) in ambient air. The argon-hydrogen gas mixture AP plasma treatment and argon LP plasma treatment were found to distinctly increase the shear bond strength for both samples at both temperatures. From X-ray photoelectron spectroscopy (XPS) analysis, the removal of organic contaminants on Au surfaces without the formation of hydroxyl groups and gold oxide is considered effective in increasing the Au-Au bonding strength at low temperature.",

author = "Michitaka Yamamoto and Eiji Higurashi and Tadatomo Suga and Renshi Sawada and Toshihiro Itoh",

note = "Funding Information: Part of this study was supported by JSPS KAKENHI Grant Numbers 23246125 and 25289085. Publisher Copyright: {\textcopyright} 2018 The Japan Society of Applied Physics.",

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AU - Yamamoto, Michitaka

AU - Higurashi, Eiji

AU - Suga, Tadatomo

AU - Sawada, Renshi

AU - Itoh, Toshihiro

PY - 2018/4

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AB - Atmospheric-pressure (AP) plasma treatment using three different types of gases (an argon-hydrogen mixed gas, an argon-oxygen mixed gas, and a nitrogen gas) and low-pressure (LP) plasma treatment using an argon gas were compared for Au-Au bonding with thin films and stud bumps at low temperature (25 or 150 °C) in ambient air. The argon-hydrogen gas mixture AP plasma treatment and argon LP plasma treatment were found to distinctly increase the shear bond strength for both samples at both temperatures. From X-ray photoelectron spectroscopy (XPS) analysis, the removal of organic contaminants on Au surfaces without the formation of hydroxyl groups and gold oxide is considered effective in increasing the Au-Au bonding strength at low temperature.

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Properties of various plasma surface treatments for low-temperature Au-Au bonding

Abstract

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