Quality control of grain boundaries in copper thin films used for 3D interconnections

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, the quality of grain boundaries was evaluated by measuring their strength. In order to evaluate the strength of grain boundaries quantitatively, a micro-tensile test method that can measure the strength of a grain boundary has been developed. A focused ion beam was used for making a fine columnar sample which consisted of two grains in series. The sample was jointed to a small both ends fixed beam made of single-crystalline silicon. A tensile load was applied and the deformation of the sample and the beam was monitored by a scanning electron microscope to measure the load-displacement relationship of the sample. The relationship between the factors of controlling strength and the mechanical properties of the copper thin films was clarified quantitatively by using the micro-tensile test.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages88-91
Number of pages4
ISBN (Electronic)9781479977277
DOIs
Publication statusPublished - 2014
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China
Duration: 2014 Oct 222014 Oct 24

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Conference

Conference9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
Country/TerritoryTaiwan, Province of China
CityTaipei
Period14/10/2214/10/24

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