Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections

Takuya Murakoshi; Ken Suzuki; Hideo Miura

doi:10.1109/IMPACT.2014.7048349

Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections

Takuya Murakoshi, Ken Suzuki, Hideo Miura

ENG - Fracture and Reliability Research Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The relationship of mechanical properties and micro texture of electroplated copper thin films used for 3D interconnections was investigated using a SEM, and an EBSD method. As a result, it was found that the mechanical properties changed due to the change of the average grain size and the crystallinity of grains and grain boundaries.

Original language	English
Title of host publication	2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publication	Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	69-72
Number of pages	4
ISBN (Electronic)	9781479977277
DOIs	https://doi.org/10.1109/IMPACT.2014.7048349
Publication status	Published - 2014
Event	9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China Duration: 2014 Oct 22 → 2014 Oct 24

Publication series

Name	2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other	9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
Country/Territory	Taiwan, Province of China
City	Taipei
Period	14/10/22 → 14/10/24

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Control and Systems Engineering

Access to Document

10.1109/IMPACT.2014.7048349

Cite this

Murakoshi, T., Suzuki, K., & Miura, H. (2014). Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings (pp. 69-72). [7048349] (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2014.7048349

Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections. / Murakoshi, Takuya; Suzuki, Ken ; Miura, Hideo.
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. p. 69-72 7048349 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Murakoshi, T, Suzuki, K & Miura, H 2014, Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections. in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings., 7048349, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 69-72, 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014, Taipei, Taiwan, Province of China, 14/10/22. https://doi.org/10.1109/IMPACT.2014.7048349

Murakoshi T, Suzuki K , Miura H. Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. p. 69-72. 7048349. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). doi: 10.1109/IMPACT.2014.7048349

Murakoshi, Takuya ; Suzuki, Ken ; Miura, Hideo. / Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections. 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 69-72 (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

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Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections

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