TY - GEN
T1 - Quantum chemical molecular dynamics analysis of the effect of intrinsic defects and strain on dielectric characteristic of gate oxide films
AU - Suzuki, Ken
AU - Ito, Yuta
AU - Miura, Hideo
PY - 2005
Y1 - 2005
N2 - In order to make clear the effect of strain and intrinsic defects in SiO2 on both its electronic and structural characteristics, we performed a quantum chemical molecular dynamics analysis for SiO2-x structure under strain. The band gap of SiO2 changes significantly by the deformation of the Si-O-Si bond angle due to the applied strain. The cristallographic structure of the SiO2-x deforms drastically because the Si-O bonds neighboring an oxygen vacancy are broken and a free silicon monoxide molecule is generated in the SiO2-x structure. The magnitude of the band gap of the SiO2-x decreases from 8.9 eV to 6.3 eV due to the change in the atomic configuration accompanying the diffusion of the free monoxide. In addition, the band gap decreases further under large tensile strain. We can conclude, therefore, that both the existence of oxygen vacancies and tensile strain in SiO2-x films deteriorate the electronic reliability of the oxide film seriously.
AB - In order to make clear the effect of strain and intrinsic defects in SiO2 on both its electronic and structural characteristics, we performed a quantum chemical molecular dynamics analysis for SiO2-x structure under strain. The band gap of SiO2 changes significantly by the deformation of the Si-O-Si bond angle due to the applied strain. The cristallographic structure of the SiO2-x deforms drastically because the Si-O bonds neighboring an oxygen vacancy are broken and a free silicon monoxide molecule is generated in the SiO2-x structure. The magnitude of the band gap of the SiO2-x decreases from 8.9 eV to 6.3 eV due to the change in the atomic configuration accompanying the diffusion of the free monoxide. In addition, the band gap decreases further under large tensile strain. We can conclude, therefore, that both the existence of oxygen vacancies and tensile strain in SiO2-x films deteriorate the electronic reliability of the oxide film seriously.
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U2 - 10.1109/sispad.2005.201539
DO - 10.1109/sispad.2005.201539
M3 - Conference contribution
AN - SCOPUS:33845873840
SN - 4990276205
SN - 9784990276201
T3 - International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
SP - 327
EP - 330
BT - 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005
Y2 - 1 September 2005 through 3 September 2005
ER -