TY - GEN
T1 - Quantum chemical molecular dynamics study of degradation mechanism of interface integrity between a HfO2 thin film and a metal gate electrode
AU - Inoue, Tatsuya
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2009
Y1 - 2009
N2 - Control of the interfacial crystallographic structure between a dielectric film and a gate electrode is one of the most critical issues for assuring the high performance and the reliability of a stacked MOS structure using high-k dielectric thin films. In this study, quantum chemical molecular dynamics was applied to explicate the mechanism of degradation of interfacial integrity of the gate stack systems which is caused by point defects. We found that point defects such as oxygen and carbon interstitials deteriorate the electronic quality of a hafnium dioxide film and the W/HfO2 interface structure. The estimated results were confirmed by experiments using synchrotron-radiation photoemission spectroscopy.
AB - Control of the interfacial crystallographic structure between a dielectric film and a gate electrode is one of the most critical issues for assuring the high performance and the reliability of a stacked MOS structure using high-k dielectric thin films. In this study, quantum chemical molecular dynamics was applied to explicate the mechanism of degradation of interfacial integrity of the gate stack systems which is caused by point defects. We found that point defects such as oxygen and carbon interstitials deteriorate the electronic quality of a hafnium dioxide film and the W/HfO2 interface structure. The estimated results were confirmed by experiments using synchrotron-radiation photoemission spectroscopy.
KW - Composition fluctuation
KW - Hafnium oxide (HfO)
KW - High-k dielectric
KW - Metal-gate electrode
KW - Quantum molecular dynamics
KW - Synchrotron spectroscopy photoemission
UR - http://www.scopus.com/inward/record.url?scp=74349128479&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=74349128479&partnerID=8YFLogxK
U2 - 10.1109/SISPAD.2009.5290215
DO - 10.1109/SISPAD.2009.5290215
M3 - Conference contribution
AN - SCOPUS:74349128479
SN - 9781424439492
T3 - International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
BT - SISPAD 2009 - 2009 International Conference on Simulation of Semiconductor Processes and Devices
T2 - SISPAD 2009 - 2009 International Conference on Simulation of Semiconductor Processes and Devices
Y2 - 9 September 2009 through 11 September 2009
ER -