@inproceedings{37bfe63fb86542cdbf46842a8239481c,
title = "Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers",
abstract = "High yield reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology is proposed for ultra-high density 2.5D/3D integration applications. New mCoW hybrid bonding technology use shallow-recess oxide structure, electro-less plated capping layers, and thin glue adhesive layer below 1um to avoid the issues of current standard CoW bonding technology. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um using chip self-assembly technology and thermal-compression bonded by in batch. In the TEG chip, totally 684,000 electrode daisy chain comprising of 3um diameter/6um pitch tiny Cu electrodes are well intact joined by new reconfigured mCoW hybrid bonding technology.",
keywords = "extrude Cu, reconfigured multichip-on-wafer hybrid bonding, terascale 2.5D/3D",
author = "Lee, {K. W.} and C. Nagai and A. Nakamura and H. Aizawa and Bea, {J. C.} and M. Koyanagi and H. Hashiguchi and T. Fukushima and T. Tanaka",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; International 3D Systems Integration Conference, 3DIC 2015 ; Conference date: 31-08-2015 Through 02-09-2015",
year = "2015",
month = nov,
day = "20",
doi = "10.1109/3DIC.2015.7334471",
language = "English",
series = "2015 International 3D Systems Integration Conference, 3DIC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "TS1.2.1--TS1.2.4",
booktitle = "2015 International 3D Systems Integration Conference, 3DIC 2015",
address = "United States",
}